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Automotive

Communication

Computing

Consumer EL

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Application

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Connectors, contacts, bussbars, and wires

Display technology and touch sensors

E-vehicle

Flex PCBs

HDI PCBs

IC substrates

Integrated circuits/ discretes

Lead frames and LED lead frames

Multilayer PCBs

QFN packages

Semiconductor

Substrate-like PCBs

Technology

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Advanced Semiconductor Packaging: Interconnect metallization

Advanced Semiconductor Packaging: Reliability & performance enhancement

Battery Lead tabs

Battery connections: connectors, bus bars and more

Battery connections: connectors, bus bars, and more

Desmear and metallization for PCBs and IC substrates

Electrolytic plating for PCBs and IC substrates

Electrolytic plating for advanced packaging

Equipment

Final Finish for PCBs and IC substrates

Metallization for display technology and touch sensors

Plating for connectors, bus bars and wires, contacts

Plating for lead frames, LEDs, IC/discretes

Semiconductor Integrated Circuit Manufacturing

Surface treatment for PCBs and IC substrates

Surface treatment for connectors, busbars and wires, contacts

Surface treatment for lead frames, LEDs, IC/discretes

Process

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Acid cleaner for LED, lead frames, and IC/discretes

Acid cleaner for electrolytic processes

Acid copper plating for LED, lead frames, and IC/discretes

Adhesion promoter

Aluminum pretreatment

Anti epoxy bleed out

Anti-tarnishing

Bonding enhancement for innerlayer

Copper surface treatment for laser direct drilling

Deflashing

Desmear and cleaning

Desmear and electroless copper plating

Direct metallization

Dryfilm and soldermask pretreatment

Dryfilm stripping

ENEPIG

ENEPIG - Pd plating

ENIG

ENIG - Au plating

ENIG/ ENEPIG

ENIG/ ENEPIG - Au plating

ENIG/ ENEPIG - Cu pre treatment

ENIG/ ENEPIG - Ni plating

ENIG/ ENEPIG - Pd plating

EPAG

EPAG - Au plating

EPAG - Pd plating

Electroless copper activation

Electroless copper plating

Electroless metallization for displays and touch sensors

Electrolytic bright tin plating

Electrolytic copper BMV filling

Electrolytic copper conformal plating

Electrolytic copper pillar plating

Electrolytic copper plating equipment (& RDL)

Electrolytic copper plating equipment (PCB/ICs)

Electrolytic copper plating for Semiconductors

Electrolytic copper through hole filling

Electrolytic gold plating for Semiconductors

Electrolytic hard gold

Electrolytic matt tin plating

Electrolytic nickel plating

Electrolytic palladium - nickel plating

Electrolytic silver plating

Electrolytic tin plating for Semiconductor

Electrolytic tin silver plating for Semiconductor

Electropolishing

High-frequency/ speed bonding enhancement

Immersion tin plating

Metallization of transparent substrates

Microetch

Nickel-Tungsten

Nickel-phosphorous

Organic solderability preservative (OSP)

Palladium metal removal

Seed layer removal

Equipment

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Barrel

Double sided plating tool

High Speed

High speed

Horizontal

Rack

Reel-to-Reel

Single wafer tool

Vertical

Vertical - insoluble anodes

Vertical - soluble anodes

Wet bench

X Reset selection

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