Polygon® PLB Line® – Atotech’s new desmear and electroless copper line for excellent blind micro via filling capability enabling high reliable multilayer, rigid-flex and HDI PCB production
Berlin, September 23, 2019: Atotech, a worldwide leader in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, will participate in this year´s edition of IPCA Expo. The trade fair will be co-located with Electronica India, Productronica India and Smart Cards Expo on September 25 – 27 in halls 11 and 12 of the India Expo Centre, Greater Noida, Delhi, India.
The Indian Printed Circuit Association (IPCA) and the IPCA Expo promote state-of-the-art PCB technology and business in India by mutual exchange of ideas and technical interactions. This trade fair brings the entire PCB industry eco-system and value chain together. It will showcase the latest PCB technologies from manufacturers and suppliers from across the globe to facilitate the growing demand of PCBs in various industry segments.
Visitors to the trade fair are invited to stop by Atotech’s booth El09 in hall 11 to talk to the Group’s PCB experts and to learn about their latest innovations, including wet chemical process and equipment solutions.
Atotech key Highlights at IPCA Expo 2019:
- Polygon® PLB Line® – is Atotech’s new desmear and electroless copper line for excellent blind micro via filling capability enabling high reliable multilayer, rigid-flex and HDI PCB production
- ViaKing® – is an enhanced graphite-based, cost effective, but technically very capable direct metallization process for flex, multilayer, HDI and exotic base materials.
- OS-Tech® – is an environmentally friendly, high functioning simple process. It can guarantee multiple solder reflow cycles whilst ensuring that the pretreatment can optimize the copper surface best-in-class and therefore facilitate an even OSP coating.