Spherolyte® Cu UF3 – Cu RDL process for microvia filling and fine line plating
Berlin, September 27, 2019: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 through October 3, 2019.
The symposium is being organized by the International Microelectronics Assembly and Packaging Society (iMAPS), who is bringing together the entire microelectronics supply chain, and it will feature five technical discussions as well as one interactive poster session.
The iMAPS technical committee is offering over 125 technical presentations and posters on today’s most relevant topics. This year Atotech will participate with two technical paper presentations:
- On Tuesday, October 1, from 4:15 – 4:40 p.m., an Atotech semiconductor expert, Dr. Ralf Schmidt, will introduce the company’s latest results on an “Optimized ECD copper RDL process with via filling capability for next generation packaging.” In his presentation at the Wafer Level / Panel Level Symposium (room 208), Dr. Schmidt will elaborate on Spherolyte® Cu UF3 and Spherolyte® Cu VR and their via filling characteristics.
- Atotech metallization expert Don Jang will give the second paper presentation on Thursday, October 3, from 10:45 – 11:10 a.m. at the Advanced Package Symposium (room 203). His topic “Nano-void formation at Cu/Cu/Cu interconnections of blind micro vias: a field study” (author: Tobias Bernhard) is highly discussed at the moment and will provide some interesting findings.
Visitors of the symposium are welcome to join Atotech’s paper presentations at the 52nd International Symposium on Microelectronics. Dr. Schmidt and Mr. Jang will be available for questions after their presentations.