Spherolyte® UF3 – Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar

Berlin, 10 May, 2019: At this year’s IEEE 69th Electronics Components and Technology Conference (ECTC) Atotech will be presenting its product lineup, roadmap and a technical paper for semiconductor advanced packaging solutions. The ECTC, held at the Cosmopolitan of Las Vegas in Las Vegas, NV, USA from May 28 till May 31, is the industry’s premier international conference, where the industry’s leading experts come together to discuss and learn about packaging, components and science and design of microelectronic components.

Atotech will showcase its latest metallization products including the Spherolyte® product line for next generation RDL and pillar, the Xenolyte® product line for all electroless metallization needs, as well as its new MultiPlate® electrolytic deposition platform, designed as a flexible solution for both wafer and panel plating. In-depth information on Atotech’s product lineup can be found at our booth 308, where Atotech experts can help select the processes and equipment for the next generations of advanced packaging techniques.

In session 3: RDL and Additive Manufacturing, on Wednesday, May 29, from 8:50 a.m. to 9:15 p.m.,
Ralph Zoberbier, Director Sales & Marketing EQ EL, will present “Optimization of Electrolytic Plating Processes for Challenging Fan-Out Panel-Level Package Designs” (co-authors: Britta Scheller, Director R&D EQ GMF / EL, and Christian Ohde, Global Application Manager PP Vertical).

For more information about Atotech or its product offering, please contact the North American sales team at: usainfo@atotech.com