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SEM micrographs of copper structure after annealing (125°C, 4h) deposited at 3 ASD with the novel chemistry

Atotech, one of the leading companies worldwide in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, will present at this year’s Electronics Packaging Technology Conference (EPTC) held at the Resorts World Sentosa in Singapore from December 4 to 7, 2018.

On December 6, 2018, from 5:00 to 5:25 pm, in Room Leo 2, Mustafa Oezkoek, Global Product Manager Panel and Pattern Plating at Atotech Group, will present “Enhancing productivity for IC-substrate manufacturing by using a novel copper electrolyte for Semi Additive Plating (SAP)”.

In his presentation, Mustafa will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.

“When operating with lines and spaces (L/S) of 10/10 μm and less, copper thickness variation is one of the critical parameters, which have to be controlled within a tight range in order to avoid reliability problems in assembly or during the lifetime. Another important parameter is the current density used for the copper plating process. The current density is important for the productivity but also impacts the surface thickness distribution which is not beneficial for the quality of the product,” states Mustafa. “We have developed an electrolyte which overcomes this conflict of productivity and copper thickness variation. Besides several beneficial parameters, its main benefit is its capability to operate at > 3 A/dm², which brings an improvement of the productivity by a factor of almost two.”

Visitors to the EPTC are welcome to join the presentation and discuss this and further market-leading new developments with Mustafa following the presentation.