Berlin, May 31, 2021 – Atotech, a global supplier of specialty chemicals, equipment, software, and services will take part and present at this year’s 71st Electronics Components and Technology Conference ECTC, which will be held as a virtual conference from June 1 through July 4.
Our topics this year include:
- “Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures”
by Tobias Bernhard, R&D Scientist at Atotech; session 40: Materials and Techniques in High-Speed Interconnect #5
- “Towards Cu-Cu Direct Bonding: Controlled Crystal Growth of Copper Deposits for Minimization of Interface Formation During Bonding”
by Ralf Schmidt, R&D Manager at Atotech; session 40: Materials and Techniques in High-Speed Interconnect #9
Both sessions will be available on demand. We look forward to welcoming you at ECTC 2021!
Conference: 71st Electronics Components and Technology Conference – ECTC
Date: June 1 – July 4, 2021
For more information, please visit: https://www.ectc.net/index.cfm
For registration, please visit: https://www.ectc.net/registration/index.cfm