InPro® RA – copper crystal structure 

Berlin, September 20, 2019: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 20th annual SMTA International Conference and Exhibition.

This year´s conference is dedicated to advancing the electronics manufacturing and assembly industry. It will be held on September 22 – 26 at the Donald E. Stephens Convention Center in Rosemont, Illinois and Features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Atotech will be hosting two presentations at the conference:

  • Atotech Product Manager for Surface Finishing, Sandra Nelle, will present a technical paper entitled: “IMC study of mid-phosphorous and high-phosphorous ENIG finishes”. The presentation will be held on September 24, 11:00 to 11:30 a.m. on the Substrates/PCB Technology Track.
  • On September 25, 11:30 a.m. to 12:00 p.m., John Foley, Systems expert at Atotech Group, will talk about the companies “New developed copper electroplating process for BMV filling with the special feature of a very bright Cu deposition on flex and flex-rigid PCB applications” on the Substrates/PCB Technology Track.

Visitors of the conference are welcome to join Atotech’s presentations at SMTA International 2019. Both product experts will be available to answer your questions after their talks.