Berlin, December 21, 2021 – Atotech, a global supplier of specialty chemicals, equipment, software, and services will take part in the TPCA Show 2021 in Taiwan, organized by the TPCA Taiwan Circuit Board Association from
December 21 – 23.
In addition to welcoming its customers and other business partners at the TPCA Show floor, Atotech is also hosting a dedicated session at this year’s IMPACT Conference, organized by IEEE-EPS-Taipei, iMAPS -Taiwan, ITRI and TPCA. The conference is the largest gathering of PCB and advanced-packaging professionals in Taiwan. The symposium this year highlights the theme “IMPACT on 5G+”. With the rapid adoption of 5G capabilities, the world is moving fast in building out new technologies such as loT, artificial intelligence (AI) and edge computing. To support this growth, heterogeneous integration schemes are continuing to evolve in order to meet the requirements for high performance computing applications, for instance. Enabling technologies such as Fan-out RDL, embedded Si bridge and others are being used to enhance die-to-die interconnect density beyond IC substrate itself but still very much rely on the design and capability of the IC substrate itself. Therefore, both, continued scaling as well as evolution of the IC substrate technology, are key to the overall advanced package capabilities. As feature sizes on IC substrate are pushed to the next generation, the yield, reliability, and performance requirements drive serious changes in materials sets, integration schemes and overall process performance requirements. Atotech will present some key enabling process solutions for the continued IC substrate scaling and is proud to host the entire session around “Next generation package substrates to support high-performance computing”.
Our team is excited and looks very much forward to welcoming you in person in Taipei. We present our most recent findings during the IMPACT conference as well as product line-up for wet chemicals and equipment process solutions for PCBs, IC Substrates, connectors, lead frames, and semiconductor applications at TPCA Show. Find us at booth K-406.
Our presentations at IMPACT:
Dec 21 | 15:40 – 16:10
Dr. Ralph Schmidt (Manager R&D)
“Towards Cu-Cu direct bonding: Controlled crystal growth of copper deposits for minimization of interface formation during bonding”
Dec 21 | 16:10 – 16:25
Thomas Thomas (Global Product Manager Surface Treatment Technology)
“Hybrid bonding enhancement system for ultra-low signal loss PCB manufacturing”
Dec 22 | 14:50 – 15:05
Britta Schafsteller (Global Product Manager Selective Finishing)
“Autocatalytic tin – opening new application opportunities for tin surface finishes”
Dec 22 | 17:10 – 17:25
Roger Massey (Technology Strategy and Strategic Marketing Manager)
“Copper Recrystallization and nano-void classification in blind micro vias”
Next-generation package substrates to support HPC
Dec 22 | 17:10 – 17:40
Kuldip Johal (Global OEM Director) and Jobert van Eisden (OEM Director North America)
“Meeting the challenges in IC-substrate scaling with next-generation process technologies for advanced HPC packaging”
More information on the show and the location can be found here:
https://tw.tpcashow.com/en/home-4/
Conference: TPCA Show and IMPACT 2021
Date: December 21 to December 23, 2021
Venue: Taipei Nangang Exhibition Center (Hall 1) – Taipei, Taiwan
Atotech Booth No.: K-406
For more information about Atotech or its product offering, please visit our homepage or contact us at: info@atotech.com.