Berlin, February 15, 2022 – Atotech is looking forward to presenting at 18th International Conference & Exhibition on Device Packaging. This international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will take place from March 7-10 in Fountain Hills, AZ.

Our experts are excited to have the opportunity to present the following technical paper:

Thursday, March 10, 2022

Time slot: 10:00 a.m. – 10:30 a.m. (MST)
Presenter: Dr. Britta Schafsteller, Global Product Manager Selective Finishing
Paper topic: How to tailor immersion tin plating for IC substrate applications






18th Annual Device Packaging Conference (DPC 2022)
Date: March 7-10, 2022
Venue: WeKoPa Resort and Conference Center in Fountain Hills, Arizona, USA

Our experts are looking forward to seeing you there!

More information on the show and the location can be found here: