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Printoganth® T1: Horizontal high throw electroless copper for amSAP technology

Berlin, 23 January, 2019: Atotech is one of the world’s leading suppliers of specialty chemicals and equipment for the printed circuit board, package substrate and semiconductor industry. At one of the industry’s premier events, the IPC APEX Expo held at the San Diego Convention Center in San Diego, USA, from January 26 to 31, 2019, the company will exhibit and present on several new product developments.

On Tuesday, January 29, from 1:30 to 3:00 p.m., Moody Dreiza, Business Director for Electronics, North America, at Atotech USA LLC, will present “Copper Filling of Blind Microvias, Through Holes and Cu Pillar Plating – The Present and the Future” in session S02 “PCB fabrication / Plating I”. “I will describe the reasons for development and a roadmap of dimensions for copper filled through-holes, blind microvias and other copper plated structures on PCBs by presenting aspect ratios, dimensions and results of plated through-holes used today in high volume manufacturing for blind microvia and through-hole filling with electroplated copper,” states Moody. His presentation will include feasibility studies of new electroplated structures for future applications such as copper pillar plating on IC-substrates.

On Wednesday, January 30, from 10:30 a.m. to 12:00 p.m., Roger Massey, Technical Marketing Manager at Atotech Group, will present “Developments in Electroless Copper Processes to Improve Performance in amSAP Mobile Applications” in session S13 “PCB Fabrication and Plating II”. In his presentation, Roger will highlight the benefits and robust performance of a newly developed electroless copper process for amSAP applications.

On Wednesday, January 30, from 3:30 to 4:30 p.m., Sandra Nelle, Product Manager for Surface Finishing at Atotech Group, will present “Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability” in session S23 “PCB Surface Finishes II”. Sandra will elaborate whether there are any ‘value added’ benefits to an HP ENIG. “I will also use data generated by Design of Experiment (DOE) to elaborate the impact of electroless nickel variables in combination with traditional and cyanide-free immersion gold on recognized quality expectations,” adds Sandra.

Atotech experts will also be on hand to discuss the latest chemistry and equipment at booth 311. Atotech’s latest products will be showcased at the booth, including:

  • Printoganth® T1, a brand new high-throw electroless copper process for advanced HDI and amSAP technology
  • Inpulse® 2THF, a versatile electrolyte for through-hole, blind microvia, and conformal plating for advanced HDI and substrate technology
  • PallaBond®, a revolutionary direct pure EPAG final finish for real fine / line applications
  • Uniplate® PLB Cu, a high throughput horizontal systems solution for desmear and metallization, that offers best cost, performance, and quality results in combination with Atotech’s Printoganth® T1 and Inpulse® 2THF process chemistry

For more information about Atotech or its product offering, please contact the North American sales team at: usainfo@atotech.com