Top: PallaBond®: copper-wire 20 μm on pure EP finish, bottom: NovaBond IT®: low roughness and high RSAI
Berlin, 15 February, 2018: Atotech is one of the world’s leading suppliers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industry. The company will exhibit at the IPC APEX Expo, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, USA.
Sandra Heinemann, Product Manager for Surface Finishing at Atotech Deutschland GmbH, will discuss how detrimental production concerns related to soldermask residues can be solved by simple operational adaptations. The presentation will be held as part of the IPC Technical Conference Session on PCB Fabrication and Materials on February 27 from 3:30 pm to 5:00 pm.
In her presentation, Sandra will focus on the chemical characteristics of soldermasks and how they can help to predict or identify potential issues before they occur in the selective finishing step of the PCB manufacturing process. She will also discuss the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. The results found will help fabricators to ensure maximum yields.
The Atotech Team of experts at booth #433 in hall E is looking forward to discuss this or any other current or upcoming production challenge or trend.
This year’s Atotech product features include:
- PallaBond®, a direct pure EPAG for soldering, gold and copper wire bonding
- Inpulse® 2 THF, for superior copper deposition in through vias
- NovaBond® IT, a non-etching adhesion promoter for advanced packaging substrates and
- Printoganth® TP1, a high throw electroless copper process
For more information about Atotech or its product offering, please contact the North American sales team at: email@example.com