Berlin, April 1, 2021 – Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for printed circuit boards, IC substrates, lead frames, connectors and semiconductor advanced packaging, is pleased to announce its participation in the 17th International Conference on Device Packaging. The conference will be held virtually from April 12 – 15, 2021.
This year Atotech Group will participate with two technical paper presentations:
- Dr. Britta Schafsteller, the company’s Global Product Manager for Selective Finishing Technologies, will give a technical paper presentation entitled “Known reliability with improved efficiency – the next generation Ni/Pd/Au finish” as part of session 3 of Automotive Applications – Advance Packaging and Test track.
- Roger Massey, Technical Marketing Manager for Desmear and Metallization Technologies, will discuss “A viable copper-based alternative to palladium activation systems for electroless copper processing” during session 4 of the Automotive Applications – Advance Packaging and Test track.
Both presentations will be available for on-demand viewing from April 12 through May 10.
Conference: 17th International Conference on Device Packaging
Date: April 12 – 15, 2021
For more information, please visit: https://www.imaps.org/device_packaging_conference.php
For registration, please visit: https://imaps.org/device_packaging_registration.php
Our technical sessions will be available on-demand from April 12:
Presentation 1: “Known reliability with improved efficiency – the next generation Ni/Pd/Au finish” by Dr. Britta Schafsteller
Presentation 2: “A viable copper-based alternative to palladium activation systems for electroless copper processing” by Roger Massey