Spherolyte® Cu UF3 – Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar
Berlin, September 16, 2019: Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, is pleased to announce its participation in this year’s SEMICON Taiwan. The exhibition will be held at the Taipei Nangang Exhibition Center from September 18 – 20.
SEMICON Taiwan is an important platform that connects Taiwan and global microelectronics ecosystems, and also provides a bridge that facilitates smooth collaboration between the electronics industry, government, academia, and research institutions.
Atotech’s experts will be present at booth K2376 on the 1st floor to discuss the latest technology, trends, and future requirements.
Highlights at the booth will include:
- Spherolyte® Cu UF3 – a high purity ECD copper process that enables stable and optimal mechanical properties within a wide process window
- AgPrep – an ultimate non etching adhesion promoter for silver surfaces
- MultiPlate® – a new system platform for FOWLP / FOPLP
We are also pleased to announce that Atotech’s semiconductor expert, Dr. Ralf Schmidt, will talk about the “Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry” in the session, ´SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 3´ on Friday, September 20, from 11:40 a.m. to 12:05 p.m..
Visitors to the show are invited to attend this presentation and stop by our booth K2376 to learn more about this and other innovative products, equipment, and process solutions Atotech provides to the semiconductor industry.