Image of a rigid-flex PCB
BERLIN, May 31, 2018: Atotech today announced that it will present its latest production solutions for the flex/ flex-rigid PCB market at the New Product Introduction (NPI) sessions at the JPCA 2018 show. The trade show will be held from June 6 to 8, 2018, at Tokyo Big Sight, East Exhibition Halls 4 to 8, in Tokyo, Japan. Next to its presentation, the company will also showcase new products from various other fields at booth 7A-16.
On Friday, June 8, from 2:50 to 3:20 pm, Jun Hotta, Manager Electronics Business Division at Atotech Japan K.K., will introduce Atotech’s new product series for flex/ flex-rigid PCB at 7H-NPI Presentation Site 2. Product highlights this year are Atotech’s new Securiganth® 800, a very reliable smear removal for through holes and surfaces, InPro® THF and InPro® MVF, two new acid copper baths ideal for superior copper filling at highest current densities, and Stanna-COF, an immersion tin bath for Chip On Film (COF). Jun will also talk about CovaBond®P 100, an adhesion enhancement process which enables unparalleled adhesion of electroless copper to the treated substrate with minimum surface roughness.
All about flex
Atotech’s new product series for flex/ rigid-flex applications is offering customers everything from desmear and metallization through to final finishing of PCBs. Recent product launches include InPro® Flex and Cupracid® Flex, economic conformal plating solutions for standard flex and rigid-flex applications, as well as Printoganth® RA, an electroless copper process for advanced FPCBs.
Cupracid® Flex and InPro® Flex
Specifically designed for standard conformal flex applications, the Cupracid® Flex process is for use in conveyorized systems with soluble anodes. For systems with insoluble anodes, InPro® Flex is the solution of choice. Both processes provide excellent pattern uniformity, as well as high throwing power and line shape, even at high current density and without any corner flattening. Both new processes consist of a simple two additive system and can be analyzed using CVS in fully automatic analysis and control system for easy maintenance.
Printoganth® RA has been specifically developed to provide next generation flex and flex-rigid PCBs with excellent adhesion on exposed polyimide areas as well as a shiny surface appearance after electrolytic copper plating. The new horizontal electroless copper process is fully compatible to ED, RA and super flexible RA (HA) copper foils. It features an exceptional throwing power into BMVs, enabling excellent coverage on all critical areas including adhesive layers. Moreover, Printoganth® RA has a fully analyzable stabilizer system for best process control.
For more information on these or other products, visitors are invited to join Atotech’s NPI presentation or pass by the Atotech booth 7A-16 from June 6 to 8 at the JPCA.