Excellent throwing power: Board thickness: 0.3mm, Hole: 0.15mm, CD: 2.8ASD, Line speed: 0.6m/min, Flow rate: 15HZ, Average TP% : 120%
Berlin, 14 June, 2018: The flex/ flex-rigid PCB market continues to grow as more and more designs call for flexible inner layers with ever finer lines and spaces. At the same time, the need for high volume reel to reel formats as well as pattern plating with lower base copper thickness drives the FPCB market.
As one of the market leaders for BMV filling and through hole filling in the IC-Substrate market, Atotech has developed two new acid copper processes – InPro® Flex and Cupracid® Flex – to serve the flexible printed circuit board market and support its customers to overcome the current technical barriers in FPCB manufacturing.
Cupracid® Flex and InPro® Flex
“Cupracid® Flex and InPro® Flex are specifically designed for standard conformal flex and rigid-flex applications. While the Cupracid® Flex process is for use in vertical systems with soluble anodes, InPro® Flex can be used in systems with insoluble anodes,” states Mustafa Oezkoek, Global Product Manager Panel and Pattern Plating at Atotech Deutschland GmbH.
The simple two additive processes can be analyzed by standard CVS method and are suitable for vertical equipment or vertical reel to reel equipment with educator or sparger systems. They can be operated in panel and pattern plating and provide excellent line shape, outstanding crystal structure and a ductility of more than 23% in either manufacturing method.
Features and benefits
“Cupracid® Flex and InPro® Flex are highly reliable processes and deliver excellent physical properties,” continues Mustafa. “Both solutions assure first-rate throwing power at high current densities without any corner flattening. At the same time, pattern uniformity and line shape are very good. And, according to IPC, the bending performance is exceptional.”
Both products have been rolled out globally and are available worldwide.