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BERLIN, May 29, 2018: Atotech today announced that it will partake in the IPC Automotive Electronics Reliability Forum with a presentation on “Dissipating Thermal Energy in PCBs – Solid Copper Through Via Filling”. The forum will be held from June 4 to 5, 2018, in Nuremberg, Germany.

The presentation will be held on Monday, June 4, from 11:40 to 12:20 pm, by Sven Lamprecht, Director OEM/ EMS Technology Exchange at Atotech Deutschland GmbH. “With demands for 5G and advanced driver assistant system (ADAS) radar devices two advancements will force PCBs into higher frequencies and higher speeds. We will enjoy 5G cellular networks from telecommunication companies with wider frequency bandwidths to give us lower latencies, and faster frequencies to give us better data rates,” states Sven and continues: “Furthermore, ADAS radar devices moved their standard up from below 30GHz to 77GHz.“ In his presentation, he will explore the processes required and discuss the challenges for solid copper through via filling for PCBs up to 1mm thickness in a high volume manufacturing (HVM) tool.

Fueled by strong growth in electric vehicles and autonomous cars, as well as a dramatic increase in electronics content in conventional automobiles and trucks, automotive electronics are crucial components of engine, ignition, and transmission management, entertainment, navigation, diagnostic tools and safety systems. With the “IPC Automotive Electronics Reliability Forum,” the IPC – Association Connecting Electronics Industries – has gathered thought leaders and subject matter experts from leading electronics and automotive companies to discuss the future of automotive electronics design and manufacturing. The forum delivers unique educational as well as networking opportunities and covers a wide breadth of relevant and timely topics. It is therefore the ideal place for Atotech to present its innovative systems and product solutions as well as its thought leadership when it comes to automotive electronics.