Berlin, November 14 — MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today announced its participation in the 50th Productonica 2025, taking place November 18 – 21 at Trade Fair Center Messe Munich. Under its strategic brands Atotech® (process chemicals, equipment, software) and ESI® (laser systems), MKS will present its latest innovations for advanced printed circuit board (PCB) and package substrate manufacturing.
Visitors are warmly invited to connect with MKS’ representatives at Booth 461 in Hall B3 and explore the future of advanced electronics manufacturing. Our experts will showcase innovations in lasers, optics, motion control, process chemistry, and advanced manufacturing equipment – technologies that are driving the evolution of PCB and package substrate production and enabling breakthroughs in miniaturization and high-speed applications for AI, high-performance computing (HPC), and next-generation electronics.
By combining these leading capabilities, MKS is uniquely positioned to Optimize the InterconnectSM – a key enabler of next-generation advanced electronics and the next frontier in miniaturization and complexity. This philosophy underscores our commitment to supporting the development of advanced PCB and package substrates through integrated solutions, including MKS’ ESI laser drilling technologies and Atotech chemistry and plating equipment.
Gain valuable insights into how MKS addresses complex interconnect challenges with solutions that deliver precision, reliability, and scalability. From enabling next-generation devices to redefining manufacturing standards, MKS is shaping the future of electronics with unmatched expertise and innovation, while providing a platform to discuss emerging industry trends and challenges.
“MKS doesn’t just support innovation – it enables it. Through our integrated technologies and deep expertise, we empower manufacturers to overcome complex challenges and accelerate progress. From advanced surface finishing to next-generation electronics solutions, we’re shaping the future of connectivity and performance for industries worldwide.”, said Daniel Schmidt, Global Marketing and Training Director.
Chemistry show highlights include:
Printoganth® P2: Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.)
Cupraganth® MV: Next-generation palladium-free e’less copper activation for package substrates
Cupracid® TP3: Advanced solution for conformal copper plating in vertical hoist type systems
Cuprapulse® XP7-UA: Precision conformal plating for the next generation of package substrates
BondFilm® EX: Bonding enhancement solution for low signal loss with high frequency applications
Cupraetch® SR 8000/DF: Dryfilm and soldermask pretreatment with advanced adhesion performance
Aurotech® G-Bond 3: New versatile gold bath for nickel/gold, nickel/palladium/gold, and palladium/gold plating
Stannatech® 2100: New optimized immersion tin process of the Stannatech evolution
Our equipment highlights for PCB production are:
vPlate®: Gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
New Uniplate®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
On the laser equipment side, promotions include:
Geode™ platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
Geode™ A: CO2 laser system for high precision and high-speed ABF build-up laminate processing
Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
Event: Productronica 2025
Date: November 18-21, 2025
Booth: B3/461
Venue: Trade Fair Center Messe Munich
For more information on Productronica 2025 please visit: Productronica 2025