Berlin, January 16 – The MKS’ Atotech and ESI teams are pleased to invite you and meet at this year’s IPC APEX EXPO in San Diego, California from January 24 to 26. Our local and global team members will be at booth 709 to discuss this year’s technical papers and related research findings, as well as provide you with the latest insights on new products and solutions for your manufacturing challenges.

Product highlights this year include:

Uniplate®: Next generation horizontal plating line
BondFilm® HP: Unmatched I/L bonding process for the most demanding bonding applications
Cupracid® TP5: Highest throwing power process excellent reliability
Aurotech® G-Bond 3: New gold electrolyte with autocatalytic properties & non-toxic stabilization
ViaKing®: Direct metallization process based on graphite
CapstoneTM: High-performance breakthrough productivity for flex PCB UV drilling
GeodeTM:  High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging

Papers at IPC APEX EXPO Technical Conference 2023:

Printed Board Plating and Finishes 1 – Jan 24 10:30 AM – 12:00 PM
“A novel copper via filling electrolyte for plating at high current densities for IC-Substrates”
Speaker: Mustafa Özkök | Global Product Manager Panel and Pattern Plating

Printed Board Plating and Finishes 2Jan 24 1:30 PM – 3:00 PM
“Enabling Non-toxic Stabilization for Mixed Reaction Gold Electrolytes”
Speaker: Dr. Britta Schafsteller | Global Product Manager Selective Finishing

Printed Board Material InnovationsJan 24 3:30 PM – 5:00 PM
“Hybrid Adhesion Enhancement Systems & Quality Control for low loss PCB Inner Layer bonding”
Speaker: Christopher Seidemann | Global Product Manager

Printed Board Material InnovationsJan 25 8:30 AM – 10:00 AM
“Controlling Recrystallisation in Plated Layers Through the Use of Additives”
Speaker: Roger Massey | Technical Marketing Manager, Atotech Group

For more information on IPC APEX EXPO please visit: Homepage | IPC APEX EXPO 2023


About MKS Instruments

MKS Instruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, advanced electronics and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed and feature enhancement for optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at