Berlin, Germany, March 24 – MKS Instruments, Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (laser systems) and Atotech (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming CPCA Show to be held at National Exhibition and Convention Center from March 24-26, 2025.
MKS will spotlight its strategic brands, Atotech and ESI, while unveiling the latest breakthroughs in PCB and package substrate manufacturing. Visitors to the CPCA booth (8B01) can explore a comprehensive portfolio of advanced solutions, including state-of-the-art chemical processes, precision production systems, auxiliary equipment, lasers, and software—all designed to maximize production yield, reliability, and efficiency, helping manufacturers achieve superior results.
Leveraging its expertise across lasers, optics, motion, process chemistry, and equipment, MKS is pioneering next-generation interconnect solutions to meet the demands of miniaturization and complexity in advanced electronics. The company’s Optimize the InterconnectSM philosophy reflects its unmatched ability to enable innovation, empowering customers and partners with integrated, cutting-edge solutions for advanced PCB and package substrate manufacturing. By combining ESI’s industry-leading laser drilling technologies with Atotech’s chemistry and plating systems, MKS is setting new benchmarks for precision, performance, and scalability—key to enabling next-generation technologies with finer features.
“Atotech is committed to delivering innovative and sustainable solutions to customers in China and beyond. With a focus on R&D, we continue to lead technological progress in the surface-finishing industry, supporting the growth of China’s manufacturing sector with cutting-edge advancements,” said Dr. James Tsai, Business Director of Greater China.
Experts from Atotech and ESI will be onsite to discuss emerging industry trends and challenges. They will also present innovative product pairings such as wet-to-wet process equipment, high-precision laser systems, chemistry solutions, software, and auxiliary tools. Visit CPCA booth 8B01 to discover how MKS is redefining possibilities in PCB and package substrate manufacturing.
Our chemistry show highlights:
Printoganth® U Plus: Industry standard for leading edge HDI PCBs
Printoganth® MV TP2: Excellent throwing power e-less Cu with less dummy plating
Inpulse® 2HFU2: Horizontal copper reinforcement with lowest surface copper plated
Cuprapulse® IN: Reverse pulse plating with insoluble anodes for HDI, MLB, and ICs
NovaBond® PX-S2: Advanced bonding enhancement for high speed signal transmission
EcoFlash® S 300: Differential etching for advanced SAP manufacturing
PallaBond® 2: The next Gen EPAG for high-end circuitry and reliability application
Stannatech® 2100: New optimized immersion tin process of the Stannatech evolution
Our equipment highlights for PCB production are:
V-Plate®: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
New Uniplate®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
Stannatech Line®: New GEN Immersion Tin Line for high volume production requirements
PLB Line®: Excellent BMV capability enabling HDI PCB production
On the laser equipment side, promotions include:
CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
Conference: CPCA Show 2025
Date: May 24 – 26, 2025
Booth: 8.1H, 8B01
Venue: National Exhibition and Convention Center (Shanghai)
For more information on CPCA Show 2025, please visit: CPCA Show 2025