Berlin, Germany, March 10 – MKS Instruments, Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI and Atotech will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming IPC APEX EXPO to be held at Anaheim Convention Center from March 15-20, 2025.
This year’s key highlights, ranging from chemical processes, production systems, auxiliaries, and lasers to software solutions, and are designed to optimize production yield, enhance reliability, and improve efficiency, providing significant advances in PCB production.
MKS is deeply committed to the Americas region, recognizing it as a fundamental part of its future growth. By partnering with leading manufacturers and advancing new technologies that enable ever-smaller feature sizes, MKS integrates its ESI laser drilling technologies with Atotech’s chemistry and plating equipment through its Optimize the Interconnect(SM) process. This synergy enhances manufacturing capabilities, driving innovation in advanced PCB and package substrate production.
“By fostering synergies across North America, our combined offering unites the best of both worlds — seamlessly blending diverse expertise, cutting-edge technology, and robust resources to drive transformative success. This powerful collaboration fuels innovation, enhances strategic alignment, and opens new pathways for growth. Together, we are not just integrating capabilities but redefining possibilities, unlocking unparalleled opportunities, and delivering measurable, lasting impact,” said Collin Peters, Business Manager Electronics North America.
Join us at IPC APEX EXPO booth 3927 for an exclusive look at the future of PCB manufacturing! Connect with industry experts ready to share insights on the latest trends and challenges. Explore cutting-edge product innovations, including next-gen wet-to-wet process equipment, advanced laser systems, smart chemistry solutions, and powerful software tools. Don’t miss this unique opportunity to see live demonstrations, discover game-changing solutions, and network with Industry and product experts.
On the chemistry side, our highlights include:
Printoganth® MV TP 2: Optimized for fine line and high-frequency applications, providing low electroless copper thickness with excellent coverage, improved dry film adhesion, reduced dummy plating, and cost-effective process performance.
InPro® MVF2: Next-generation blind micro via filling for HDI production
EcoFlash® S 300: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide
CupraEtch® SR8000: Cost-effective, cupric chloride-based microetching system that enhances dryfilm and soldermask adhesion through a simple three-step process, offering uniform surface roughening and easy integration into existing lines
PD-Core®: Versatile Palladium plating solution for plating on copper and nickel with low Pd-content and long lifetime for reduced process cost
Our equipment highlights for PCB manufacturing are:
vPlate®: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
Uniplate® P, LB, CP/NP, IP2: Equipment for desmear, electroless Cu, direct metallization, and electrolytic Cu plating
On the laser equipment side, promotions include:
GeodeTM G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
CapStoneTM Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
MKS will present three outstanding paper presentations:
Tuesday, March 18, 10:00 a.m. – 12:00 a.m.
“Pure Palladium plating for ENEPIG – how bath properties impact the process handling and final finish performance”
Speaker: Joe McGurran | Product Marketing Manager and Technology Specialist, MKS Atotech
and
“Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper with Enhanced Reliability in State-of-the-Art Server Technology”
Speaker: Dirk Ruess | Global Product Manager Equipment, MKS Atotech
Tuesday, March 18, 3:30 p.m. – 17:00 p.m.
“Capabilities and Challenges in Taking the Step From HDI to Advanced HDI”
Speaker: Roger Massey | Technical Marketing Manager, MKS Atotech
Conference: IPC APEX EXPO 2025
Date: March 15 – 20, 2025
Booth: 3927
Venue: Anaheim Convention Center
For more information on the show, please visit: Homepage | IPC APEX EXPO 2025