Berlin, Sep 28 — MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today highlighted Everplate Cu 300 2TF from its Atotech brand. This electrolytic copper process is designed for next-generation semiconductor manufacturing and enables the deposition of fine-grained, metastable copper for direct Cu-to-Cu bond formations in advanced semiconductor packaging.
As advanced packaging architectures move toward larger panel formats, tighter overlay, lower warpage, and higher I/O density, glass is gaining relevance as a substrate option for heterogeneous integration. At the same time, the very properties that make glass attractive also make metallization more difficult. MKS’ Atotech’s wet process is designed to convert this materials challenge into a manufacturable flow for production-oriented environments.
Supporting hybrid bonding manufacturability
Hybrid bonding is becoming increasingly important as semiconductor packaging advances toward smaller, denser assemblies and finer interconnection pitches, particularly in applications such as high-bandwith-memory (HBM), 3D NAND, and high-performance computing 3D system-on-chip. The process involves bringing extremely flat, smooth, and clean surfaces into contact to create direct bonds without the use of adhesives or solders. It typically combines dielectric bonding at ambient temperature with annealing. During this process, the copper expands to close the remaining gaps and form direct metallurgical bonds. Everplate Cu 300 2TF is designed to deliver precise, stable process control for low-temperature hybrid bonding. It also supports high-density interconnect formation with fine-grained copper that maintains structural stability and promotes recrystallization during thermal processing.
Everplate Cu 300 2TF enables direct Cu-to-Cu bond formation using fine-grained, metastable copper and supports low-temperature bonding for high-density interconnects. Additionally, it is designed to maintain copper structural stability through thermal processing. These characteristics are intended to help manufacturers better manage thermal budgets, improve process reproducibility, and support broader manufacturability as hybrid bonding moves closer to production scale.
Built for advanced packaging roadmaps
By enabling direct Cu-to-Cu bond formation with fine-grained metastable copper, Everplate Cu 300 2TF expands the MKS’ Atotech semiconductor portfolio for next-generation advanced packaging. The company’s semiconductor offering focuses on wet chemical process solutions for pad metallization, copper pillar, redistribution layer, via plating, and interconnect metallization for advanced packaging and power semiconductor applications.
“As hybrid bonding moves closer to broader manufacturing adoption, customers need copper processes that support bond quality, thermal budget control, and reproducibility in advanced packaging flows,” said Britta Schafsteller, Global Product Manager for Semiconductor at MKS’ Atotech. “Everplate Cu 300 2TF is designed to help manufacturers address these requirements as they scale next-generation interconnect architectures.”
Atotech, a brand within the Materials Solutions Division of MKS, develops process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Its portfolio includes chemistry, equipment, software, and services for high-technology applications and is supported by a global TechCenter network and on-site customer support.
Key technical highlights
- Why hybrid copper bonding is becoming important for fine-pitch 2.5D and 3D integration
- The hybrid bonding process, from copper deposition and CMP to pre-bonding and annealing
- The role of copper microstructure in low-temperature Cu–Cu interface formation
- The Everplate® Cu 300 fine-grain electroplating process
- Queue-time stability and thermally activated copper grain growth
- The influence of via geometry and seed-layer texture on recrystallization
- Process-integration considerations for wafer-to-wafer and die-to-wafer bonding
Download the full white paper for detailed process insights, performance results and application examples using the link below:
>Download Link<
For more information, please contact us at: info-atotech@mks.com.
About MKS Inc.
MKS Inc. (NASDAQ: MKSI) enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, electronics and packaging, and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed, feature enhancement, and optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at www.mks.com.
About Atotech
Atotech, a brand within the Materials Solutions Division of MKS Inc., develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, the Atotech portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information, please visit us at atotech.com.