Berlin, July 28 — MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today announced an integrated wet metallization process from its strategic brand Atotech for glass substrate manufacturing. Designed for panel- and wafer-level plating on glass, the process addresses three key manufacturability challenges: adhesion to chemically inert glass, conformal seed coverage in through-glass vias (TGVs), and void-free copper filling for downstream redistribution layer build-up.
As advanced packaging architectures move toward larger panel formats, tighter overlay, lower warpage, and higher I/O density, glass is gaining relevance as a substrate option for heterogeneous integration. At the same time, the very properties that make glass attractive also make metallization more difficult. MKS’ Atotech’s wet process is designed to convert this materials challenge into a manufacturable flow for production-oriented environments.
Three-step wet process for plating on glass
The integrated process combines three sequential wet-chemical steps that function as a coupled system. First, VitroCoat® GI provides adhesion promotion through an ultra-thin metal-oxide layer that chemically bonds to glass and enables subsequent wet metallization. Second, Cupratech® GI M deposits an electroless copper seed layer with conformal coverage across the glass surface and into high-aspect-ratio TGVs, creating the conductive foundation for further build-up. Third, InPro® Pulse TGV applies reverse pulse plating to guide copper deposition toward the via center, enabling void-free TGV filling with low overburden for improved electrical and thermal conductivity, mechanical integrity, and surface planarity.
From feasibility to industrialization
By combining adhesion promotion, electroless seeding, and reverse-pulse via filling in one coordinated sequence, the process supports fine-line downstream manufacturing while reducing complexity associated with alternative Ti/TiW-based PVD flows. Panel sizes up to 515 × 510 mm have already been demonstrated in the underlying technical materials, indicating that the discussion is moving beyond basic feasibility toward industrialization, process integration, and glass-handling discipline.
“Glass is attractive because it can enable tighter overlay, lower warpage, and higher-performance package designs, but those same material properties make metallization significantly more demanding,” said Roger Massey, Senior Manager Technical Marketing Manager and Global Product Manager PTH/STT, MKS’ Atotech. “Our wet metallization approach addresses adhesion, seed coverage, and TGV filling as one connected manufacturing sequence, creating a more practical path from qualification to production.”
Key technical highlights
- Three-step wet metallization process for plating on glass
- VitroCoat® GI for adhesion promotion on chemically inert glass
- Cupratech® GI M for conformal electroless copper seeding in TGVs
- InPro® Pulse TGV for void-free reverse-pulse TGV filling
- Supports panel-level manufacturing and downstream fine-line processing
With this integrated process, MKS’ Atotech expands its advanced packaging portfolio to support glass-core substrates and glass interposers as these technologies move closer to production-scale adoption.
Download the full white paper for detailed process insights, performance results and application examples using the link below:
>Download Link<
For more information, please contact us at: info-atotech@mks.com.
About MKS Inc.
MKS Inc. (NASDAQ: MKSI) enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, electronics and packaging, and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed, feature enhancement, and optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at www.mks.com.
About Atotech
Atotech, a brand within the Materials Solutions Division of MKS Inc., develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, the Atotech portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information, please visit us at atotech.com.