Berlin, November 7 – Atotech, MKS’ globally leading brand in surface-finishing solutions announced today to take part at this year’s Semicon Europa, the key event for the European semiconductor industry. The event will be co-located with electronica and will be held at Messe Munich from November 12 – 15, 2024.
MKS will highlight its core brands, Atotech®, Newport®, Ophir® and Spectra-Physics® and will showcase the full range of advanced plating solutions tailored to the diverse needs of next-generation semiconductor manufacturing.
These offerings include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications as well as electroless processes for example for power semiconductors. The portfolio also consists of a comprehensive range of tin processes, adhesion promoters, and post-treatments specifically designed for lead frames.
On November 13, Jessica Stubbe, Global Application Manager will present latest findings on Advanced Electrolytes Meeting Future Requirements in Microbump Technology at the Advanced Packaging Conference (APC). The study explores advancements in electrochemical deposition (ECD) for meeting smaller bump sizes in advanced packaging, from Flip Chip to 3-D stacking. It focuses on the challenges in ECD processes for Cu, Ni-alloy, and Sn-alloy, particularly in micro bump development. NiFe alloy is evaluated as an effective diffusion barrier, with experimental results highlighting its promise for addressing miniaturization challenges.
This year the spotlight is on the following featured Atotech products:
ENEPIG for pad metallization and RDL housing:
- Xenolyte® Au TG: Autocatalytic process for deposition of thick Au layers for metal pads
- Xenolyte® Au TG C Plus: Electroless process for thick gold deposition with high bath stability
- Xenolyte® Pd HS: Pure Pd deposits for high reliability pad metallization and RDL housing
Pillar applications:
- Spherolyte® Cu FP: Pure Cu micro-bump process for fine pitch applications
- Spherolyte® Ni: All liquid component ECD Ni electrolyte for highly uniform plating
- Spherolyte® NiFe: Effective magnetic shielding and diffusion barriers
- Spherolyte® SnAg: High-speed process for lead-free, pure and uniform solder bump plating
RDL applications:
- Spherolyte® Cu UF 3: Copper RDL process for fine line plating and microvia filling
MKS’ Newport, Ophir and Spectra-Physics representatives will be showcasing their Surround the Wafer® offering. This includes innovative products and services for semiconductor manufacturers to meet the challenges of ultra-thin films, new materials, and intricate 3D structures.
This year the spotlight is on the following featured products:
Photonics Solutions:
- MKS DynamYX® Series Air Bearing Positioners: Specifically designed for semiconductor manufacturing, DynamYX systems provide the highest level of commercially available positioning performance
- Piezo Motor, Miniature Motorized and Manual Positioners: Positioning solutions to build optical paths for inspection and lithography
- Complex Optics & Optical Assemblies: Custom designed high precision optical assemblies
- Isolation and Vibration Control: MKS sets the standard for vibration control with over 50 years of experience
- Nano-, Pico- and Femtosecond Lasers: High precision ultrafast lasers for semiconductor manufacturing applications
- Laser Power Sensors: Comprehensive portfolio of laser power sensors to measure short pulse lasers with nano- and picosecond pulse widths
Vacuum Solutions:
- Pressure and Flow Measurement
- Gas and Vacuum Analysis and Control
- Plasma and Reactice Gas
- DC, RF, and Microwave Power Supplies
For more information on Semicon Europa, please visit: Home | SEMICON Europa