Berlin, November 4 – Atotech, a globally recognized brand of MKS Instruments specializing in surface-finishing solutions, will participate in the first CPCA Plus Show at the Shenzhen World Exhibition and Convention Center, taking place from November 6-8, 2024.
The company will present its combined new product offering of its strategic brands Atotech® (process chemicals, equipment, software, and services) and ESI® (laser via drilling systems) to provide leading manufacturing solutions for printed circuit boards and package substrate manufacturing.
MKS Instruments’ Optimize the InterconnectSM innovative approach brings together its industry-leading expertise in lasers, optics, motion, process chemistry, and precision equipment. This initiative is set to redefine the future of advanced electronics, unlocking new possibilities in miniaturization and design complexity. “At MKS, we’re uniquely positioned to drive forward the development of next-generation advanced PCBs and package substrates. Our powerful combination of MKS’ ESI laser drilling technologies with Atotech’s advanced chemistry and plating equipment enables us to deliver smaller feature sizes and cutting-edge solutions for our customers and partners. We are excited to support the next wave of technological advancements with our comprehensive capabilities, fueling progress in advanced electronics and shaping the future of interconnect technology, said James Tsai, Business Director for Greater China at MKS’ Atotech.
A distinguished team of industry and technology experts from MKS’ Atotech and ESI brands will be at booth 8C05, ready to discuss the latest industry trends and challenges. Attendees are invited to explore the company’s integrated product offerings, featuring PCB production chemicals, equipment, , laser tools, and variety of auxiliary equipments, as well as latest service solutions.
Eddy Chen, Marketing Manager for Greater China at MKS’ Atotech, stated: “This event plays a vital role in promoting collaboration and innovation within our industry. I am honored to showcase our optimized PCB solutions, which significantly improve bonding, soldering, and adhesion processes. Together, we are not only advancing excellence but also shaping the future of electronics manufacturing.”
Product highlights at the show
Chemical process highlights include:
EcoFlash® S300: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide
NovaBond® PX-S2: NovaBond® PX-S2 improves PCB performance by using selective nano-roughening and chemical adhesion to ensure superior signal integrity and thermal reliability without changing trace geometry
Cuprapulse® IN: Overcomes the limitations of DC technology and offers unparalleled throwing power and productivity increase
InPro® SAP3: AdvancedBMV filling process that offers excellent copper uniformity and stable production at high current densities for VCP systems with insoluble anodes
Printoganth® MV TP3: An advanced electroless copper bath that delivers a uniform 100-150 nm copper deposit on IC substrates, ensuring excellent adhesion to low-roughness dielectrics and reliable bottom-up recrystallization
ViaKing®: Enhanced graphite-based direct metallization process offering high reliability, low cost of ownership, and excellent stability for both high and low volume production
Aurotech® G-Bond 3: New versatile gold bath for nickel/gold, nickel/palladium/gold and palladium/gold plating
Stannatech® IC: Immersion tin solution for package substrates, providing reduced soldermask attack and copper dissolution, superior foaming control, with optimized metal ion exchange and contamination management
NEAP: A non-etching adhesion promotor for lead frame packages to prevent delamination issues between silver metal surfaces and epoxy molds
Anti EBO T13: Prevents epoxy bleed-out on silver, copper, and Ni/Pd/Au surfaces, ensuring strong adhesion and bond quality for optoelectronics and automotive use
Equipment highlights include:
vPlate®: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
New Uniplate®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
G-Plate®: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
PLB Line®: Cutting-edge desmear and electroless copper production line developed by MKS’ Atotech, leveraging 30 years of expertise in PCB equipment manufacturing
Horizon®: Optimized PCB solutions for enhanced bonding, soldering, and adhesion
Geode™ A: CO2 laser system for high precision and high-speed ABF build-up laminate processing
Geode™ G2: Next generation Geode™ PCB laser drilling system for HDI and package substrate processing
Capstone™: Flex PCB UV drilling tool for high-performance breakthrough productivity
For more information please visit: CPCA Plus Show 2024