Berlin, June 12, 2023 – MKS’ Atotech will be participating at the upcoming Semicon China a leading exhibition for China’s semiconductor industry. The event will take place from June 29 – July 1, at the Shanghai New International Expo Centre. MKS’ Atotech product experts will be available at booth E5243 and the team is looking forward to introducing the latest solutions for wet metallization for power semiconductors, advanced packaging, and lead frames.

Modern semiconductor devices require different plating solutions for various applications and structures. MKS’ Atotech provides leading ENEPIG and ENEPAG plating solutions for pad metallization for bonding, soldering applications, and RDL housing in power semiconductors, as well as electrolytic processes for pillars, micro vias, fine line RDL, and solder applications. A broad portfolio of Sn processes, adhesion promoters, and post-treatments for lead frames completes the portfolio.

This year’s show highlights include:

Xenolyte® Au TG – A new autocatalytic, thick Au process for final finish on Ni or Pd for pad metallization

Xenolyte® Ni TR – A new high temperature resistant Ni for RDL and pad metallization

Xenolyte® Pd HS – A new pure Pd deposits for high reliability pad metallization and RDL housing

StannoPure® 3000 E – A new sustainable high-speed matte tin process

PPFPrep – A new NEAP solution that assures excellent adhesion and significant cost savings

Event: Semicon China 2023
Date: June 29 – July 1, 2023
Venue: Shanghai New International Expo Centre
Booth: E5243

For more information on Semicon China please visit:  SEMICON China 2023.