Atotech® product experts will be available at booth K2270 in hall 1 to talk about the range of plating solutions to meet the diverse requirements of modern semiconductor devices. The current offer includes plating solutions to meet the diverse requirements of modern semiconductor devices. These solutions include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications for power semiconductors. Additionally, the portfolio encompasses a wide selection of tin processes, adhesion promoters, and post-treatments specifically designed for leadframes.
At the show, the following products will be highlighted:
Spherolyte® Cu UF5 – Tailorable and pure high-speed copper pillar plating
Spherolyte® Cu DB – Next gen Cu-to-Cu direct bonding
Spherolyte® SnAg – High-speed SnAg for lead-free, pure and uniform solder bump plating
Protectostan® Plus 3 – High performance “2-in-1” tin post-dip
StannoPure® PF 10 – High-speed green tin process for leadframes and connectors
AgPrep – A new NEAP solution that assures excellent adhesion and significant cost savings
Event: Semicon Taiwan 2023
Date: September 6-8, 2023
Venue: TaiNEX Hall 1 und 2; Taipei
Booth: K2270 in Hall 1
For more information on SEMICON Taiwan please visit: SEMICON Taiwan 2023