Berlin, September 3 — MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today announced its participation in KPCA 2025, taking place September 3 – 5 in Songdo Convensia, Incheon, Korea. Under its strategic brands Atotech® (process chemicals, equipment, software, and services) and ESI® (laser systems), MKS will present its latest innovations for printed circuit board (PCB) and package substrate manufacturing.
Visit MKS at booth G201, where the company will showcase latest innovation in lasers, optics, motion control, process chemistry, and advanced equipment – key innovations shaping the future of PCB manufacturing. These highlights will provide visitors insights into how MKS is addressing interconnect challenges and enabling next-generation miniaturized electronics with precision and highest reliability.
Housic Hong, Business Manager Electronics for MKS’ Atotech brand, stated:
“As we advance further into the age of hyperconnectivity and intelligent technologies, the importance of printed circuit boards, packaging substrates, and semiconductor innovations continues to grow. In 2025, these foundational components are driving transformative progress—from high-speed 5G networks and AI-powered data centers to the electrification of mobility and the emergence of hydrogen-fueled transportation solutions.”
MKS’ Atotech brand continues to lead with cutting-edge innovations, including Printoganth® MV TP3, a next-generation electroless copper metallization process that deposits ultra-thin copper layers for SAP/ABF substrates. and NovaBond® PX-S2, which improves PCB performance by using selective nano-roughening and chemical adhesion to ensure superior signal integrity and thermal reliability without changing trace geometry. These solutions are engineered to meet the growing demands of miniaturization, high performance, and environmental sustainability.
They form part of MKS’ integrated technology portfolio, which brings together advanced chemical processes, precision laser systems, and smart manufacturing tools —delivering comprehensive support for next-generation electronics manufacturing. “Our mission is to empower our customers with technologies that not only enhance performance and reliability but also contribute to a more sustainable electronics ecosystem,” Housic added. “Together, we are shaping a future that is more connected, efficient, and environmentally conscious.”
On September 4, from 10:30 a.m. to 11:30 a.m., Kukrok Park, Electronics Senior Sales & CS Engineer, will present our latest innovation: Printoganth® MV TP3 Series, a revolutionary electroless copper plating for next gen package substrates. The talk will also highlight proven reliability in BMV fill, wedge structures, and complex dielectrics, supported by customer evaluations and field testing.As the semiconductor industry advances toward finer features, greater interconnect densities, and increasingly complex architectures, the demand for reliable, high-performance metallization solutions becomes more critical than ever. The MV TP3 Series is specifically engineered to meet these challenges, offering superior throwing power, excellent uniformity, and enhanced adhesion. These capabilities make it an ideal choice for SAP (Semi-Additive Process) and mSAP (modified SAP) applications in high-density interconnect (HDI) and package substrate manufacturing.
Other highlights include:
Chemicals:
Aurotech® G-Bond 3: New versatile gold bath for nickel/gold, nickel/palladium/gold and palladium/gold plating
Inpulse® 2HF9: Delivers superior BMV filling with minimal surface copper plating, excellent planarity, high productivity, and proven reliability for mass HDI production
Printoganth® U Plus: Industry standard for HDI PCBs, offering excellent copper-to-copper interconnections under severe thermal shock and meeting top reliability standards from leading automotive and smartphone OEMs
NovaBond® PX-S2: Improves PCB performance by using selective nano-roughening and chemical adhesion to ensure superior signal integrity and thermal reliability without changing trace geometry
OS-Tech®SIT2: Organic surface finish offers a solderable, eco-friendly option for electronics, ensuring multiple reflow cycles and compatibility with Atotech’s ENIG processes, with coating thickness as a key quality control measure
Equipment:
Uniplate® PLB Cu6 (for mSAP): Energy-efficient horizontal equipment solution for producing reliable fine-line interconnects with superior copper plating performance and minimized handling requirements
Geode™ platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
Capstone™: Flex PCB UV drilling tool for high-performance breakthrough productivity
Event: KPCA 2025
Date: September 3-5, 2025
Booth: G201
Venue: Songdo Convensia, Incheon, Korea
For more information on KPCA 2025 please visit: KPCA 2025