Berlin, September 1 — MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today announced that it will showcase the full range of solutions tailored to the diverse needs of next-generation semiconductor manufacturing at the upcoming TaiNEX Hall 1 and 2 in Taipei, Taiwan, on September 10-12, 2025. In addition, representatives supporting the Newport™, Ophir®, and Spectra-Physics® brands will be available to highlight the company’s Surround the Wafer® offering.
At booth K2160, MKS’ Atotech representatives will present a comprehensive suite of advanced plating solutions designed to meet the diverse needs of next-generation semiconductor manufacturing. These offerings include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications for power semiconductors. The portfolio also features a wide range of tin processes, adhesion promoters, and post-treatments specifically tailored for lead frames.
On September 9, Dirk Tews, Director R&D, will share latest findings on low-temperature hybrid bonding for high-density interconnects using fine-grained copper (fg-Cu). This method, involving a next-gen ECD copper electrolyte, maintains structural stability and promotes recrystallization, making it suitable for advanced 3D-stacked devices.
This year the spotlight is on the following featured Atotech products:
Everplate® Cu 300 2TF: Deposition of fine-grained metastable Cu enabling direct Cu-to-Cu bond formations
Spherolyte® SnAg2: High-speed process for lead-free, pure and uniform solder bump plating
Stannolyte® B/ST: Electroless immersion tin plating for semiconductor applications
Spherolyte® NiFe: All-liquid ECD NiFe electrolyte for barrier plating and electromagnetic shielding
AgPrep: Ultimate non etching adhesion promoter to achieve MSL1 for leadframe
Stannopure® PF 10: High-speed, BPA- and PFAS-free tin plating process with exceptional surface distribution, designed to achieve perfect tin coverage on challenging connector and lead frame types
Protectostan® Plus 3: Green (PFAS free) postdip for tin to preserve solderability under steam or heat
ppfPrep: NEAP for pre-plated lead frames assuring excellent adhesion and significant cost savings
MKS’ Newport, Ophir and Spectra-Physics brand representatives will be showcasing our Surround the Wafer® offering. This includes innovative products and services for semiconductor manufacturers to meet the challenges of ultra-thin films, new materials, and intricate 3D structures.
This year, the following products are featured:
Photonics Solutions:
Talon® APX UV laser: Industry-leading UV lifetime in the 15-30 W range for extended maintenance cycles and increased productivity
Talon® AceTM UV100 laser: TimeShift™ programmable pulse capability for high-speed micromachining of advanced materials
Vacuum Solutions:
LIQUOZON® VariO3: Ozonated water delivery system improves water usage efficiency by lowering initial water consumption and reclaiming used process water
DI-SolverTM NH3 Delivery System: Compact, stand-alone solution that delivers dissolved ammonia water for wet cleaning, leveraging its alkaline chemistry to enhance ESD protection during rinsing, particle lift-off, and residual particle removal
Event: SEMICON Taiwan 2025
Date: September 10-12, 2025
Booth: K2160
Venue: Taipei Nangang Exhibition Center
For more information on SEMICON Taiwan please visit: SEMICON Taiwan 2025