Berlin, March 9, 2026 — MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest manufacturing solutions for printed circuit board (PCB) and package substrate production at Intelligent Asia 2026. The exhibition will take place March 11–13 at the Bangkok International Trade and Exhibition Centre (BITEC), Thailand.
At booth E130, MKS will showcase a comprehensive portfolio spanning precision chemistry, advanced plating systems, laser drilling platforms, optics, motion control, IIoT software, and training solutions. Together, these technologies support the company’s proprietary Optimize the InterconnectSM approach – an integrated strategy designed to address the growing demands for miniaturization, higher interconnect density, reliability, and performance in next-generation electronics manufacturing.
This year’s showcase highlights production solutions for HDI and ultra-high-layer-count PCBs, innovations for EV battery systems, and advanced processes supporting the rapidly expanding markets of automotive electronics, AI and HPC servers, consumer electronics, and 5G/6G infrastructure.
Driving the next phase of PCB innovation in Southeast Asia
Southeast Asia is rapidly emerging as a strategic hub for resilient, innovation-driven PCB manufacturing. With increasing investment and a maturing ecosystem, the region is strengthening its role as a stable production base amid global supply chain shifts. For PCB manufacturers, the focus is shifting from cost-driven growth to scaling high-complexity, sustainability-oriented technologies.
Sujaree Kaewgun, Business Manager Electronics at MKS’ Atotech, explains: “The next wave of manufacturing competitiveness will come from deeper integration – linking chemistry, equipment, data, and automation into one optimized ecosystem. By combining advanced process chemistry with precision hardware, inline monitoring, and digital control, we enable customers to achieve new levels of yield, consistency, and reliability.
The demand for skilled engineers and scientists is at an all-time high. We are pleased to introduce MKS Academy, a training platform designed to meet this immediate need, offering a scalable format that supports both individual career growth and corporate success.”
Technical program highlights
On March 12 (2:20 – 2:50 p.m., Seminar Stage), Akif Oezkoek, Senior Manager Global Application Development, will present the latest advancements in horizontal plating solutions tailored for AI server applications. The session will demonstrate how optimized plating technologies improve uniformity, reliability, and throughput while addressing the demanding electrical and thermal requirements of next-generation AI hardware.
Later that day at 4:20 p.m., Thomas Beck, VP MSD Japan/SEA Sales & General Manager, will join the panel discussion “PCB Manufacturing & Materials Trends in Southeast Asia: From Materials to Processes.” The discussion will explore how evolving regional demand is shaping Southeast Asia’s role in the global PCB value chain.
Technology highlights
MKS will feature a broad range of advanced process and equipment solutions, including:
Chemical process innovations (Atotech Products)
Printoganth® U Plus – Industry-standard metallization process for HDI PCBs delivering exceptional copper-to-copper reliability under severe thermal stress
Printoganth® P2 – Advanced horizontal electroless copper process offering superior throw into blind microvias and nano-void-free deposits for high-frequency and flexible applications
Inpulse® 2HF9 & 2HFU2 – High-performance copper filling and reinforcement processes enabling fine line/space geometries and reliable mass HDI production, including AI applications
Aurotech® G-Bond 3 – Versatile gold plating solution supporting Ni/Au, Ni/Pd/Au, and Pd/Au finishes
Stannatech® 2100 & StannoPure® PF10 – Optimized immersion tin processes for high-volume PCB and lead frame applications.
Novabond® PX-S2 & BondFilm® HF1000 VS – Advanced bonding enhancement processes tailored for high-speed AI, HPC, and high-frequency designs
Equipment solutions (Atotech Products)
Uniplate® PLB Cu6 – Energy-efficient horizontal plating platform for reliable fine-line interconnect production with optimized handling and copper performance
Stannatech LINE® – Next-generation immersion tin line designed for high-volume manufacturing environments
Laser platforms (ESI Products)
Geode™ Platform Solutions – Advanced CO₂ and UV laser systems for PCB and package substrate via formation
Geode™ G2 – Next-generation CO₂ laser drill engineered for precision HDI and IC packaging applications
Enabling high-performance interconnect manufacturing
By integrating laser systems, advanced metallization chemistries, precision plating equipment, optics, and digital process control, MKS delivers a cohesive manufacturing ecosystem that enables PCB and substrate manufacturers to overcome increasing interconnect complexity while improving productivity and sustainability.
Intelligent Asia 2026 provides an opportunity for customers and partners to explore how MKS technologies support higher-density interconnects, improved thermal performance, and scalable production for next-generation electronics.
Event Details
Conference: Intelligent Asia 2026
Date: March 11–13, 2026
Booth: E130
Venue: Bangkok International Trade and Exhibition Centre (BITEC), Thailand