InPro® THF: Current density: 3.0 A/dm², dimple < 3μm
Berlin, 15 May, 2018: Atotech today announced that it will showcase its latest production solutions for advanced HDI and flex/ flex-rigid PCBs in hall C1 booth number AN6 at the C’Tex 2018 show. The trade show will be held in the Suzhou International Expo Center from May 16 to 18. Next to its product promotion at its trade show booth, the company takes part in the New Product Introduction sessions with the introduction of its new InPro® THF chemistry.
On Thursday, May 17, from 2:00 to 2:40 pm, Mustafa Oezkoek, Global Product Manager for Panel and Pattern Plating at Atotech Deutschland GmbH, will present InPro® THF for advanced HDI (mSAP). InPro® THF provides reliable BMV filling performance at high current densities up to 3 A/dm² especially for (a)mSAP applications in mass production. The process meets the technological and yield requirements for next generation HDI and packaging and provides pattern plating with excellent pattern distribution. It may also be used for TH filling and reduces the number of processing steps needed, thereby leading to improved reliability, productivity, and reduced costs. The three additive component system further provides excellent stability without the formation of harmful breakdown products.
Additional product highlights at Atotech’s booth will be Cupracid® Flex / InPro® Flex, an economic conformal plating solution for standard flex and rigid-flex applications, and Stanna-COF, an immersion tin for chip on film technology.
Cupracid® Flex / InPro® Flex
Cupracid® Flex and InPro® Flex are specifically designed for standard conformal flex applications. The Cupracid® Flex process is for use in vertical systems with soluble anodes whereas InPro® Flex can be used in systems with insoluble anodes. Even at higher current density, pattern uniformity and line shape are very good. Both processes consist of a simple two additive system and provide excellent throwing power at high current densities without any corner flattening.
Stanna-COF is the latest extension to Atotech’s already well versed immersion tin family. The application enables Chip On Film (COF) technology. With Stanna-COF, the chips are bonded straight onto the tracks necessitating a smooth and even finish. The process assures improved yields and functionality and allows for high volume reel to reel production. Stanna-COF has the potential to enhance fine line capability and provides a protective and functional final finish as demanded by this technology.
For further information on these new products, visitors to the show are invited to join Atotech’s New Product Introduction presentation or pass by the Atotech booth in hall C1 number AN6 during the C’Tex show from May 16 to 18. Local and international product specialists will be on site to discuss any question or inquiry.