Formation of a 3D fillet on the flank of a QFN; Source: Micronas, Freiburg, Germany
Berlin, 29 August, 2018: Atotech today announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018 with a booth (booth no. 20) and a paper presentation on “Improving reliability by forming a 3D connection for Quad Flat No-lead ICs using immersion tin”. The conference will be held at the Ramada Plaza in Melaka, Malaysia, from September 4 to 6, 2018.
As a key note presenter, Rick Nichols, Global Product Manager Surface Finishing at Atotech Group, will speak in session D6 on September 6, from 10:30 am to 12:10 pm. “The surfaces of Quad Flat No-lead (QFN) devices are usually electrolytically tin plated on the contacts and heat sink. This technique limits the connection to the bottom surface of the IC and is only two dimensional,” states Rick and continues: “The incorporation of an immersion tin process will make a 3D connection or fillet possible.” In his presentation, Rick will explore the processes required and highlight the main benefits, which are quality enhancement and the potential to improve the reliability of automatic optical inspection (AOI).
Traditionally, the IEMT Conference 2018 focuses on new and future technology trends and intelligent innovations. So what can one expect from Atotech this year? Atotech announced a special product feature on next generation copper pillar plating and an inventive non-etching adhesion promoter for advanced packaging substrates.
Spherolyte® Cu RDL/ Pillar 3
Spherolyte® Cu RDL/Pillar 3 is the next generation of high speed copper pillar plating for advanced packaging, permitting high speed pillar plating of up to 4.0 µm per minute. Its primary feature is a pure copper deposition, which is achieved through a lower incorporation of organic impurities of the additive system. This leads to lower void formation at the intermetallic phase and allows the elimination of the nickel plating step. Spherolyte® Cu RDL/Pillar 3 also enables flat and recess free pillar plating, even when plating on top of μ-vias.
NovaBond® IT is a new and innovative non-etching adhesion promoter (NEAP) for inner-layer bonding and soldermask pretreatment. It combines the benefits of a non-etching surface treatment with enhanced peel strength and thermal reliability. This superior performance is achieved on standard ABF build-up films as well as soldermasks and high frequency materials. NovaBond® IT promotes the formation of a nano-dimensional copper oxide structure, adding a superb surface area increase to the conductors, but hardly contributing to the surface roughness.
Visitors to the show are invited to stop by and meet the Atotech team at booth number 20 to find out more about the special featured products or simply to discuss future industry and technology trends and innovations with Atotech’s leading experts and specialists on site.