Electronics FAQs – Surface Finishing for PCBs, IC Substrates, and Semiconductors
This FAQ section focuses on MKS’ Atotech’s electronics solutions, and the surface finishing processes used in PCB manufacturing, IC substrates, and semiconductor applications. Alongside general questions about MKS Atotech, it covers topics such as process performance, reliability, sustainability, and technical support.
The goal is simple: To help electronics manufacturers understand how Atotech technologies work, what problems they solve, and how they support high yields, stable processes, and industry compliance.
What solutions do MKS’ Atotech offer for semiconductor advanced packaging?
MKS’ Atotech delivers a full suite of solutions for advanced semiconductor packaging including:
- Wet chemical processes for pad metallization, copper pillar plating, RDL (redistribution layer) and µ‑vias.
- Electroless and electrolytic plating chemistries, such as the Spherolyte® and Xenolyte® product families, engineered for high‑density interconnects and 3D packaging.
- Integrated equipment, software and service offerings that support wafer‑level packaging (WLP), fan‑out wafer‑level packaging (FOWLP), system‑in‑package (SiP) and heterogeneous integration.
These solutions enable manufacturers to meet demanding requirements for miniaturisation, high I/O density, new materials, and next‑generation device architectures.
What surface finishing solutions does Atotech offer for electronics manufacturing?
MKS Atotech Atotech offers a comprehensive portfolio of surface finishing solutions tailored for electronics manufacturing, including:
- Surface Treatment & Pretreatment: Chemistries like BondFilm® EX and CupraEtch® SR for cleaning, adhesion promotion, and micro-roughening — ideal for HDI, IC substrates, and high-frequency applications.
- Electrolytic & Electroless Plating: Solutions for copper pillar plating, via filling, RDL, and leadframe finishes — supporting advanced packaging and miniaturized PCB designs.
- Integrated Systems: Full process solutions combining chemistry, production equipment, software, and global technical support — ensuring high performance, stability, and process control.
These technologies support high-density, high-reliability manufacturing in sectors like 5G, automotive, mobile, and semiconductors.
Which MKS’ Atotech solutions are designed for automotive electronics and advanced connectivity?
Atotech offers a specialized portfolio for automotive electronics and advanced connectivity applications, including:
- Electrolytic Copper Plating: Products like Cupracid® AC6 and Cuprapulse® XP8, tailored for high-reliability PCB manufacturing used in control units, sensors, and ADAS modules.
- Final Finishes & Connectors:
- Silvertech C: A hard silver-carbon plating for EV connectors and chargers.
- Aurocor: High-speed hard gold plating for wear-resistant, reliable automotive connectors.
- NEAP Series: Adhesion promoters for robust mold-to-metal bonding in high-temperature, humid environments.
- Advanced Pretreatment: Surface cleaning and bonding solutions (e.g., BondFilm®) engineered for HDI and high-frequency automotive PCBs.
- System Solutions: Integrated chemistry + equipment for cost-efficient, scalable production with automotive-grade process control.
These solutions support mission-critical applications in electric vehicles, ADAS, infotainment, powertrain electronics, and high-speed connectivity.
What is MKS’ Atotech Digital Factory Suite and how does it help PCB production?
The Digital Factory Suite (DFS) is MKS’ Atotech smart manufacturing platform for PCB and substrate production. It connects equipment, collects real-time data, and uses analytics to optimize performance. DFS helps reduce downtime through predictive maintenance, lowers energy and resource use, improves traceability and quality, and supports sustainability goals. It can be integrated into both new and existing production lines, helping manufacturers move toward Industry 4.0.
Where are MKS’ Atotech global TechCenter locations for electronics support?
MKS Atotech operates 8 global TechCenters dedicated to electronics and semiconductor manufacturing. These centers are located in:
Germany, Japan, China, Taiwan, South Korea, India, and Singapore.
They provide local R&D, pilot production, analytical services, and hands-on customer support for PCB, package substrate, and semiconductor applications — helping customers accelerate innovation and improve production performance
Looking for more details on electronics solutions?
If you didn’t find the answer about PCB plating, IC substrates, or other electronics processes, you can contact our experts directly via the form below. We’ll provide practical, clear guidance to help you optimize your electronics manufacturing.
Contact us