Optimize the interconnect℠
Atotech plating equipment and process chemistries combined with ESI laser drilling systems
MKS combines Atotech’s systems technology and chemical processing expertise with ESI’s via drilling expertise, forging two pioneers in PCB solutions. This synergy drives the development of adjacent PCB processing technologies and pushes the boundaries of the interconnect. This industry leading approach is creating solutions for complex PCB and Package Substrate manufacturing, satisfying current requirements as well as those needed for future roadmaps.
Together with our customers we are addressing the complex PCB design challenges and driving the future of electronics through miniaturization and complexity. Our comprehensive suite of “Optimize the Interconnect” offerings ensures integrated solutions for improved reliability, productivity, and performance in the face of evolving PCB complexity. Optimize the Interconnect℠ places us at the forefront of innovation, shaping the miniaturization and complexity landscape of the next generation of electronics.
Our combined solutions offering
Atotech leading plating systems
Uniplate® and Horizon®
The combination of ESI Geode ™ Via Drilling system together with our Horizon® and Uniplate® product family plus chemistry solutions enables us to provide to the complete production system from LDD pretreatment to flash copper plating. This allows us to coordinate the process and production parameters as best as possible and thus realize the best interconnects. Our Horizon® and Uniplate® systems provide an industry-leading transport system and reliable process control features, using fully automated control systems and analysis equipment to ensure that the optimal process parameters are always maintained. At the same time, the system offers minimal consumption of energy, water and chemicals through the use of highly efficient components and chamber design.
vPlate®
Touchless transportation of PCBs and advanced pattern filling of next generation HDI and package substrates.
In combination with our InPro®-series, it is the best choice for BMV and TH filling applications for HDI, SLP, and ICS substrates. Touchless transportation of panels down to 36 μm + 2×2 μm Cu clad, DC, or reverse pulse plating capabilities, and an achieved uniformity of below 7% makes vPlate the advanced pattern plating tool for next-generation HDI and package substrates down to L/S 8/8.
ESI Geode™ Via Drilling System
Geode™
Laser processing and engineering expertise that delivers breakthrough levels of productivity and yield.
ESI’s most advanced HDI microvia drilling solution for precision processing of your HDI, SLP and ICP applications. The Geode™ laser drilling system combines a powerful CO2 laser with a set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.
Surface treatment
- LDD pre-treatment: our BondFilm LDD® is an industry-leading pre-treatment that creates a special brown oxide layer that minimizes backscatter of the laser energy pulse. The layer also acts as a thermal insulator, resulting in a steep temperature rise only at the laser target area, ensuring the largest via sizes per energy is applied. BondFilm LDD helps to boost the drilling performance Co2 lasers by preparing the surface in order to increase the laser energy intake and preventing the copper surface acting like a heatsink.
- Laser drilling splash removal: our BondFilm LDD SR® is our laser spatter removal that compensates for height differences caused by molten excess copper evaporating from the drilled via hole. It does not add roughness to the board and produces perfectly drilled vias. BondFilm LDD SR is primarily designed to remove the spatter that occurs after laser drilling but can be used for many applications that require the removal of organics, surface layers or roughness from a copper surface. It flattens the copper surface and leaves a smooth, perfectly flat layer on top. Depending on the etch depth used, it can also act as a polisher, leaving a shiny copper surface.
Desmear and metallization
Ajinomoto bare laminate: Prior and after desmear (magn. 1000x)
- Desmear: our Securiganth® product range is ideally suited for smear removal during IC Substrate, HDI, and multilayer PCB production. Dedicated suites of chemistries are available for both horizontal and vertical processing, and used in combination with the Oxamat® regeneration system offer unrivaled process performance, stability, and lifetime.
- Activation: based on our unique ionic Pd formulation, the Neoganth® range is the mainstay of activation for high volume horizontal electroless copper deposition. Providing excellent coverage on both the bulk resin and glass reinforcement, the Neoganth® activator baths operate at a wide range of metal concentrations and ensure maximum process flexibility and performance.
- Electroless copper metallization: our Printoganth® P2 is the latest generation of the “P series” of horizontal electroless copper solutions. Providing excellent throwing power into challenging vias and a wide compatibility with plating electrolytes, Printoganth® P2 can be considered a universal electroless copper bath that makes it the ideal choice for manufacturers who focus on advanced HDI, use a wide range of dielectrics, or have a broad product mix.
Electrolytic copper filling
- InPro®: our vertical process series is designed for electrolytic copper plating in vertical equipment with insoluble anodes in DC and pulse mode. We have solutions for conformal plating, BMV and TH filling and pillar/ bump application for MLB, HDI, ICS substrates and PLP (Panel Level Packaging ) applications. It can be best combined with our vPlate VCP system.
- Inpulse®: our horizontal process series is designed for electrolytic copper plating in horizontal equipment with insoluble anodes and pulse plating. We have solutions for conformal plating, BMV and TH filling. Market-leading process for HDI Anylayer technology and inclusion-free TH filling. It is the market-leading process for HDI Anylayer technology and inclusion-free TH filling and provides processes for MLB, HDI and ICS substrates. It works best with our dedicated Uniplate InPulse Cu system in combination with our patented Fe-Redox system for best customer satisfaction.
What inspires us
Why did we develop the leading integrated approach Optimize the interconnect℠?
Your challenge
In the dynamic world of printed circuit board (PCB) manufacturing, the quest for precision is paramount, driven by intricate designs and the incorporation of challenging materials. The microscopic intricacies of electronic components demand unwavering accuracy, especially in critical processes such as pre- and post-treatment to laser drilling, laser direct drilling, electroless metallization and electrolytic plating. During laser drilling, even a minor deviation can disrupt connections, emphasizing the critical nature of precision. Surface treatment, metallization and blind micro via filling, essential for proper electrical conductivity, demands meticulous application expertise to ensure uniformity and reliability.
Our solution
MKS` Atotech addresses the challenges of precision in PCB manufacturing through its strategic fusion of technologies. By combining Atotech plating equipment and process chemistry with ESI Geode™ for optimized laser drilling expertise, we provide an industry leading integrated approach for complex PCB and Package Substrate manufacturing. This solutions offering ensures that the complexities of intricate PCB designs and challenging materials are effectively addressed, leading to superior yields. The fusion of these technologies contributes to precision in the manufacturing process, enabling customers to stay ahead of the competition in the dynamic field of PCB manufacturing.
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