Spherolyte® Ni
All liquid ECD Ni electrolyte for highly uniform plating
Outstanding properties
Of deposits
Robust
process
Great barrier function and excellent uniformity
Wide operating window
Extended additive suite
All liquid Ni plating process for various applications
Spherolyte Ni is an all-liquid electrolyte used for a broad set of applications such as Ni diffusion barrier, NiFe permalloy, Ni micropillars and Ni TSV. To allow the broad applicability of the Ni electrolyte, a broad range of additives exist which allows the tuning of the process to required needs. In addition to different leveler and accelerator, Spherolyte Ni Iron additive acts as a source of iron for NiFe alloy plating. For more details about available additives, simply contact us.
- Advanced packaging
- Cu diffusion barrier & shielding
- All liquid product – no powder handling necessary
- Excellent diffusion barrier for Cu
- Usable for NiFe alloy-permalloy-plating / Ni TSV application
- Excellent uniformity / throwing power performance
- Long bath life / good stability
- Easily analyzable and maintainable plating system
- Wide operating window
What inspires us
Why we developed Spherolyte® Ni
Your challenge
Advanced packaging technologies have emerged as enablers to further miniaturization and enhanced performance. Driven by the increasing demand for faster and better performance leading to devices shrinking more and more, electromagnetic shielding is essential to provide the required reliability. The industry is focused on technologies that provide higher throughput, exceptional reliability performance and optimal yield.
Our solution
Spherolyte® Ni allows broad applicability with a broad range of additives. Leveler and accelerator allow tuning of via filling capabilities while the additive reduces internal stress and acts as an iron source for NiFe alloy plating. NiFe alloys achieve electromagnetic shielding and ultimately improve device reliability.