Spherolyte® Sn
Highly uniform Sn plating
Excellent
uniformity
Optimized for new design requirements
No
voiding
Even at high current densities
High
purity
High-speed plating with best reliability
Sn electrolyte for solder bump and pillar applications
Spherolyte® Sn 2 and Spherolyte® Sn 3 are electrolytes depositing pure tin solder bumps. The product fulfills the high-reliability requirements of next-generation advanced packaging applications. The robustness of the process allows long bath lifetimes and high-speed plating while ensuring the highest purity and void-free results.
Depending on the required application, the choices are either Spherolyte® Sn 3 with a simple single additive system or Spherolyte® Sn 2, using a conventional multi-additive fine-tuning process. The single additive system allows very simple process control, while multi additives allow more detailed adjustments for individual needs and preferences.
- Tin plating for solder bump applications
- Advanced packaging
- Consumer electronics
- Pure tin deposits
- No voiding at high current densities
- Additive system which is easy to analyze
- Possible to operate at RT
- Applicable for high current densities / deposition speed up to 4 µm/min
- Good solderability / reflow performance
What inspires us
Why we developed Spherolyte® Sn
Your challenge
Next generation advanced packaging requires reliable and fast plating process. Tin plating, especially solder bumps, demand high CoP uniformities. Processes like these require robustness throughout the whole process while maintaining excellent characteristics in purity, especially void-free deposits and bath lifetimes.
Our solution
Spherolyte® SN 2 and Spherolyte® SN 3 are the electrolytes of choice to deposit pure Sn solder bumps that fulfill the high reliability requirements of next generation advanced packaging applications. The single additive system of Spherolyte® SN 3 allows a very simple process control, while Spherolyte® SN 2 allows the fine tuning of process parameters via individual adjustment of the different additives.