Spherolyte® SnAg
Highly uniform SnAg plating
Excellent uniformity
Optimized for new design requirements
Cost efficient
DMR qualified
Highest purity
For high-speed plating with best reliability
SnAg electrolyte for advanced packaging
Spherolyte SnAg is a direct metal replenishment (DMR) qualified process which is optimized for new design requirements. It delivers high reliability at moderate costs. The robustness of the process allows long bath lifetimes and high-speed plating while ensuring highest purity and void-free results.
- Tin-silver plating for solder bump applications
- Advanced packaging
- Consumer electronics
- Cost efficient due to DMR qualification – up to 70% CoM reduction
- Excellent uniformity for WID – for complicated designs lowest possible values generated
- High speed platin capability up to 15 ASD
- Highest purity and reliability
- Adjustable and uniform Ag content from 0 – 3.5 wt%
- Robust plating process with long life-time – bath-life > 200 Ah/L
What inspires us
Why we developed Spherolyte® SnAg
Your challenge
Next generation advanced packaging requires reliable and fast plating process. Tin-silver plating, especially solder bumps, demand high CoP uniformities. Processes like these require robustness throughout the whole process while maintaining excellent characteristics in purity and bath lifetimes. Tin-silver and especially pure tin solder demand highest purity which are met by high manufacturing costs.
Our solution
Spherolyte® SnAg is the electrolyte of choice for high-speed tin-silver solder deposits. The process is DMR (direct metal replenishment) qualified and thus allows up to 70 % CoM reduction. The high purity of the deposited material results in excellent voiding performance after reflowing as well as high reliability and yield. Our process allows constant tin-silver ratio for excellent solder process control.