Berlin, 12 June, 2024 – Atotech, a leading surface finishing brand of MKS Instruments, will participate in the SNEC PV 2024 in Shanghai, China from June13 to15, showcasing innovative plated metallization technology for c-Si solar cells.
The International Photovoltaic Power Generation and Smart Energy Conference & Exhibition [SNEC PV POWER EXPO 2024] was initiated and co-organized by the Asian Photovoltaic Industry Association (APVIA), Chinese Renewable Energy Society (CRES), Chinese Renewable Energy Industries Association (CREIA), Shanghai Federation of Economic Organizations (SFEO), Shanghai Science & Technology Exchange Center (SSTEC), Shanghai New Energy Industry Association (SNEIA) and 25 international associations and organizations. SNEC has become the biggest international PV tradeshow with incomparable influence in China, in Asia and even in the world. SNEC will showcases PV manufacturing facilities, materials, PV cells, PV application products and modules, PV projects and systems, energy storage and mobile energy, covering every section of the entire PV industry chain.
MKS’ Atotech offers groundbreaking metallization processes, engineered to ensure the mechanical reliability and robust stability of solar cell fingers and busbars. Our electroplating technology not only boosts cell efficiency but also revolutionizes cost efficiency by significantly reducing or even eliminating silver consumption.
The company’s innovation lies in the stack plating of a nickel seed layer, highly conductive copper finger, and ultra-thin surface finish by tin or silver. Plated Ni/Cu/Ag or Ni/Cu/Sn contacts provide reliable alternatives to screen-printed metallization, significantly cutting material costs while enhancing sustainability.
Our copper grid metallization pilot line is ready to demonstrate our metallization technology, offering a silver-free or drastically reduced silver consumption solution. This initiative aims to address the issue of high silver consumption in solar cell manufacturing, bolstering the Chinese PV industry’s global competitiveness while fostering sustainability and cost reduction.
Our product portfolio includes a range of targeted developments, from pretreatment to acid copper, electrolytic, immersion tin, and related protective agents.
This year’s show highlights include:
Pretreatment and post-treatment
CupraPro® PV 8: Mild acidic pretreatment for wetting and oxide removal
CupraEtch® PV7: Etch-back solution for copper seeds
Nickel plating
Nimate® PV: Nickel process providing thin nickel layer as seed layer and diffusion barrier
Copper plating
Cupracid® PV family: Copper process providing highly conductive copper fingers, exhibiting excellent electrical behavior.
Tin plating
The tin surface finish ensures solderability for a reliable cell connection. As a protective layer it also shelters the copper from any environmental impact.
Stannacid® PV: Standard tin process
Niveostan® PV 20: High speed tin process
Silver plating
Argalux® PV: Silver capping layer, depositing silver flash and prepares the surface for soldering processes
Join us at booth F07 to delve deeper into how our MKS’ Atotech metallization processes can elevate performance and productivity. We’re excited to meet you there!
Conference: 17th International Photovoltaic Power Generation and Smart Energy Conference & Exhibition
Date: June 11 ‒ 15, 2024
Booth no.: F07, hall 3
Venue: National Exhibition and Convention Center, Shanghai, China
For more information, please visit: https://pv.snec.org.cn/?locale=en-US