Conference: TPCA 2017

Date: October 25 – 27, 2017

Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan

Atotech booth no.: K818

Atotech is looking forward to participate in the 2017 TPCA Show and IMPACT conference in Taipei, Taiwan. Come by and learn everything about our latest capabilities for building the next generation HDI PCB (substrate-like product) using (a)mSAP technology or solutions for high-end flex and rigid-flex OLED PCBs. In addition, we present our solutions for future mobile and automotive chip-sets using FOWLP and FOPLP.

At this years IMPACT conference we will present a series of different topics, from metal oxide adhesion and wet chemical metallization on glass to through hole copper filling for the next generation packaging. We also touch the topic of Wafer Level Packaging moving towards Panel Level Packaging and outline the pros and cons, as well as demonstrate Atotech‘s role in this movement and solutions.

Additionally, we will launch 3 new products to the market during the NPI seminar:
#1 InPro® – New VCP additive generation for best performance in the market
#2 PallaBond® – New direct pure EPAG for soldering, gold- and copper-wire bonding
#3 Innolyte® – New electrolytic copper plating solution for panel level packaging applications

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