Pallaganth® and Noviganth® BV
Low build, vertical Pd/Sn activated electroless Copper process for HDI and multilayer PCB production
Mature technology
Atotech have over 10 years of production experience with colloidal Pd/Sn based activation systems and their associated electroless Copper baths
Excellent reliability
Based on EDTA, Noviganth® BV is a robust and stable process solution
Mixed production capability
CCL and bare materials due to good bath activity
- Multilayer and HDI PCB
- High reliability PCB applications
- Very mature technology
- Robust Pd/Sn activator operating at 40 ppm
- Robust EDTA based electroless Copper bath
- Low build bath 0.35-0.4µm in 15 min
- Excellent coverage & reliability performance
- Cost-effective process
What inspires us
Why we developed Pallaganth® and Noviganth® BV
Your challenge
Achieving high reliability interconnects, suitable for challenging applications with an easy to operate vertical electroless Copper process.
Our solution
The combination of the Pallaganth® BV activator with the Noviganth® BV electroless Copper bath, gives a simple and robust vertical electroless Copper process that is ideally suited for high volume PCB production.
Optimized for coverage and reliability performance, while operating at a low Pd content, the process as a whole offers a low running cost with an ease of operation that is attractive to todays PCB manufacturers.
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