Cuprapulse® XP8
Precise copper deposition for reduced cost of ownership
HAR at increased productivity
Conformal copper plating using soluble anodes with reverse pulse plating grants high throwing power in high aspect ratio through holes
For reduced cost of ownership
The higher applicable current densities by using reverse pulse lead to higher productivity in contrast to traditional DC plating with very uniform appearance, resulting in decreased cost of ownership.
Optimised for mass production
High current densities up to 5 A/dm² applicable for high throughput in VCP and hoist type systems
6.0 mm thick panel, 0.2 mm hole diameter (AR 30:1), throwing power>80%
The process is the successor of our well-known pulse plating solution Cuprapulse® XP7 for high aspect ratio conformal copper plating with soluble anodes. DC technology does not even come close to the throwing power performance achieved with Cuprapulse® XP8. High current density pulse plating allows for increased productivity with simultaneous quality improvements such as better surface distribution and line shape. Cuprapulse® XP8 offers better process stability, a wider working window and enhanced surface appearance. The process can be used for both panel and pattern plating applications.
This process is based on a two additive system using leveller and brightener for an easy process control by CVS method.
- Economical conformal plating for MLB and HDI high aspect ratio applications
- Process using soluble anodes
- Ideally suited for vertical conveyorized application using sparger
- Applicable for conventional hoist type equipment using air agitation
Throwing power>100%; SST 6 × 288°C passed
- Excellent throwing power in through holes
- Applicable for high current densities from 1.2 A/dm² to 5 A/dm²
- High throwing power combined with low surface thickness ensures cost saving in anode material and post treatment processes as well as higher productivity
- Excellent physical properties like ductility and tensile strength, passing standard reliability tests
- Analysable by CVS method for best process control
What inspires us
Why we developed Cuprapulse® XP8
Your challenge
In today’s ever-changing electronics industry, achieving the desired copper thickness (CuT) in through holes and BMVs is critical to reliability. A low-throw process requires more CuT to meet the minimum copper requirement in the hole, while a high-throw process achieves this with less surface copper, reducing plating time and cost.
Our solution
To tackle this issue, we have developed Cuprapulse® XP8, a breakthrough innovation that revolutionises conformal copper plating. It ensures precise copper deposition inside holes, thereby significantly improving throwing power. This new process achieves, for example, >23 μm inside the hole with only 25 μm on the surface for an aspect ratio of >20:1, outperforming traditional DC plating methods. Its reverse pulse plating technology increases productivity by up to 60% and reduces the plated copper costs. Cuprapulse® XP8 is ideal for increasing productivity and reducing costs, guaranteeing precision and efficiency while overcoming the limitations of fine-line plating and improving overall quality. Cuprapulse® XP8 can be used in vertical conveyorised plating systems (VCP) as well as in conventional hoist type equipment. Upgrade to Cuprapulse® XP8 for remarkable copper plating results and increased productivity.