InPro® SAP3
High productivity IC Substrate BMV filling electrolyte for best uniformity & line shape at high current density
Excellent filling performance
with dimple <5 μm
Highest within-unit distribution
for advanced IC substrates designs
Best reliability
thanks to excellent physical properties and crystal structures
InPro® SAP3
Achieve unmatched uniformity, a very good BMV filling, and a perfect rectangular line shape with our advanced IC substrate via filling solution. Designed specifically for insoluble anode SAP processes, it operates efficiently within a current density range of 1 A/dm² to 3 A/dm². Our product is compatible with various vertical conveyorized systems, making it ideal for both panel and pattern plating applications. For optimal process control, this solution employs a three-additive system – leveller, brightener, and carrier – all manageable through the CVS method.
Maximize your plating efficiency and quality with our InPro® SAP3 via filling technology, that ensures optimal results with a perfect rectangular line shape.
- BMV filling process for use in VCP systems with insoluble anodes
- Compatible with all vertical equipment types and leads to superior rectangular line shapes
- Copper filling performance is uniform in a wide working window to ensure stable and reliable production results for fine line applications
- Unmatched rectangular line shape
- Excellent copper within-unit thickness uniformity at high currentdensities
- Very good filling performance with dimple <5 µm in 60/30 μm blind vias
- High applicable current densities (up to 3 A/dm²)
- For VCP with inert anodes and sparger electrolyte agitation
- Easy control of additives using CVS
What inspires us
Why we developed InPro® SAP3
Your challenge
With the increasing complexity and miniaturization in the IC substrate industry, achieving uniform copper filling in blind micro vias (BMVs) has become a significant challenge. High-density interconnects and fine line applications demand precise control over the plating process to ensure reliability and performance. Traditional plating processes often struggle with maintaining uniformity at high current densities, leading to inconsistencies and defects in the substrate.
Our solution
In response to these challenges, the InPro® SAP3 process was developed. This advanced BMV filling process is designed for use in vertical conveyorized plating (VCP) systems with insoluble anodes. It ensures excellent within-unit copper thickness uniformity even at high current densities of up to 3 A/dm². By utilizing a stable three-additive system controllable by the CVS method, InPro® SAP3 provides a reliable and efficient solution for both panel and pattern plating applications. This results in high productivity, stable performance, and minimal defects, meeting the stringent demands of modern IC substrate manufacturing.
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