The complete line of final finishes

for today’s and future market needs

Aurotech® G-Bond

Autocatalytic Au for ultimate bondability

40 percent cost advantage

compared to electrolytic gold

Semi autocatalytic gold bath

with lifetime more than 4 MTO and best in class stability

Auto-dosing system

for stable process control

Aurotech® G-Bond is a gold finish able to satisfy specialized functions.

Superior gold performance with autocatalytic benefits

Aurotech® G-Bond is an alternative to electrolytic gold which has a traditional foot hold in the electronics industry. The thickness can be manipulated to ensure best wire bonding results without the requirement for extra front end design to incorporate an electrolytic bussing system.

Aurotech® G-Bond is an autocatalytic gold that can satisfy the thickness requirements perceived necessary for reliable wire bonding. The process provides an ideal finish for ENEPAG applications or in combination with future nickel free precious metal finishes.

  • High gold-thickness ENEPAG applications which require more than 0.1 µm Au
  • Al- and Au-wire bondable surface finish

Aurotech® G-Bond performance indicators

  • 4 MTO lifetime
  • Deposition thickness control by time and temperature
  • 0.3 μm in 60 min
  • Auto-dosing system for stable process control
  • Best in class stability

What inspires us

Why we developed Aurotech® G-Bond

Your challenge

Ensure best wire bonding results by application of gold layer thickness > 0.1 µm for ENEPAG or EPAG.

Our solution

Aurotech® G-Bond is an autocatalytic gold that can satisfy the thickness requirements perceived necessary for reliable wire bonding. The process provides an ideal finish for ENEPAG applications or in combination with future nickel free precious metal finishes.

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