Aurotech® G-Bond
Autocatalytic Au for ultimate bondability
40 percent cost advantage
compared to electrolytic gold
Semi autocatalytic gold bath
with lifetime more than 4 MTO and best in class stability
Auto-dosing system
for stable process control
Aurotech® G-Bond is a gold finish able to satisfy specialized functions.
Superior gold performance with autocatalytic benefits
Aurotech® G-Bond is an alternative to electrolytic gold which has a traditional foot hold in the electronics industry. The thickness can be manipulated to ensure best wire bonding results without the requirement for extra front end design to incorporate an electrolytic bussing system.
Aurotech® G-Bond is an autocatalytic gold that can satisfy the thickness requirements perceived necessary for reliable wire bonding. The process provides an ideal finish for ENEPAG applications or in combination with future nickel free precious metal finishes.
- High gold-thickness ENEPAG applications which require more than 0.1 µm Au
- Al- and Au-wire bondable surface finish
Aurotech® G-Bond performance indicators
- 4 MTO lifetime
- Deposition thickness control by time and temperature
- 0.3 μm in 60 min
- Auto-dosing system for stable process control
- Best in class stability
What inspires us
Why we developed Aurotech® G-Bond
Your challenge
Ensure best wire bonding results by application of gold layer thickness > 0.1 µm for ENEPAG or EPAG.
Our solution
Aurotech® G-Bond is an autocatalytic gold that can satisfy the thickness requirements perceived necessary for reliable wire bonding. The process provides an ideal finish for ENEPAG applications or in combination with future nickel free precious metal finishes.