The complete line of final finishes
for today’s and future market needs
Aurotech® G-Bond 2
Autocatalytic Au for ultimate bondability
40 percent cost advantage
compared to electrolytic gold
Semi autocatalytic gold bath
with lifetime more than 4 MTO and best in class stability
for stable process control
Superior gold performance with autocatalytic benefits
Aurotech® G-Bond 2 is an alternative to electrolytic gold which has a traditional foot hold in the electronics industry. The thickness can be manipulated to ensure best wire bonding results without the requirement for extra front end design to incorporate an electrolytic bussing system.
Aurotech® G-Bond 2 is a mixed reaction gold with high autocatalytic portion which allows the deposition on nickel without corrosive attack. It is applicable for the plating of ENIG, ENEPIG and EPAG deposits and is capable to plate high gold thickness of 0.1 µm and above.
- ENIG, ENEPIG and EPAG plating
- Plating of high gold thickness of 0.1 µm and more
- No corrosive attack to nickel due to autocatalytic properties
- Lifetime of 6 MTO and more
- Deposition thickness control by time and temperature
- 0.3 µm in 60 min
- Auto dosing system for easy handling and process control
- Best in class stability
What inspires us
Why we developed Aurotech® G-Bond 2
Ensure minimized corrosive attack during ENIG deposition to provide high reliable finishes fulfilling latest industry demands.
Aurotech G-Bond 2 is a mixed reaction gold with high autocatalytic portion which can satisfy the highest ENIG corrosion requirements. The process is additionally applicable for plating of ENEPIG and EPAG providing a universal solution solderable and wire-bondable final finishes.