Coping with the harsh environment of multiple Pb-free soldering with a complete line of final finishes for package substrates and PCBs
- Highest global market share for final finishing
- Complete portfolio of final finishes
- Production proven lead free processing
- OEM relevant development
- ENIG / ENEPIG
- Immersion Tin
Electroless Nickel / Immersion Gold (ENIG)
- Aurotech® Plus: An Atotech optimized ENIG process that is designed specifically with high end HDI manufacturing in mind. Dramatically reduced in nickel corrosion, minimized extraneous nickel plating and outstanding soldermask mask and base material compatibility, are all primary benefits. Whilst technically assured; Aurotech® Plus offers cost saving through extended lifetimes, excellent distribution and process control.
- Aurotech® HPE: An ENIG process developed especially for the high corrosion resistance requirements of mobile handset manufacturers. Its nickel layer with high phosphorous content provides significantly better protection versus an aggressive environment than conventional nickel layers with mid or low P-content. The process is qualified and in mass production for the world’s leading cellular phone fabricators.
- AuNic®: A drop-in process for existing standard ENIG lines. It consists of five main steps: cleaning, micro-etch, activation, electroless nickel and immersion Gold. The most distinguishable feature of AuNic® is the introduction of the additive AuNic® EN C, which is added for bath make-up and after idle times instead of performing dummy plating.
- Aurotech® Flex M: A mid phosphorous electroless nickel process that achieves market-leading bending performance due to the specifically engineered depositional characteristics. It reveals good results for both: ENIG and ENEPIG. A long lifetime at low loading factors underlines its outstanding properties for modern flex applications.
Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG)
- Universal ASF®: Universal ASF is a multi-purpose surface finish employing palladium instead of thick gold layers for top reliability. Atotech offers both Pd-P and pure Pd that have market-leading stability attributes. The process solves extraneous nickel and skips plating. It offers market-leading stability and minimizes nickel corrosion (10 MTO). Universal ASF can be combined with semi autocatalytic gold (ENEPAG).
- Universal Finish SolderBond®: A process for PCB´s and high reliability applications, which can provide three surface finishes, depending on the process sequence. The palladium layer is pure. No phosphorus is co-deposited The PCB manufacturers can choose the process, which give them the most benefit, because the existing Aurotech® CNN ENIG process can be updated to an ENEPIG Process.
Electroless Palladium Autocatalytic Gold (EPAG)
- PallaBond®: A new direct Palladium surface finish process with an optional gold layer. The PallaBond® process allows the direct deposition of palladium on copper, without using any nickel and offers 2-3 times more production capacity because of shorter deposition time compared to ENEPIG.
Other benefits are:
- Enables wire bonding with Cu, Cu-Pd, Au and Ag wire
- Thickness < 0,2µm allowing very fine L/S
- Less water consumption because of easier, shorter process
- Less energy consumption because of low process temperatures
- No nickel chemistry waste
- Stannatech® 2000 H and V: The Industry benchmark for immersion tin for multiple Pb-free soldering and press-fit technology. Within the electronics industry immersion tin is recognized as a reliable surface finish for both PWBs and IC substrate applications. The leading immersion tin process is combining chemistry process and system technology for horizontal and vertical equipment.
- Stannatech SF 8 H and V®: Stannatech SF 8 has been developed specifically to allow an optimized rinsing by a reduced viscosity of the plating bath. This comes along with a reduced Copper dissolution and solder mask attack. The new process maintains the market-leading speed and quality assurances expected of Atotechs immersion tin finishes.
- Stannatech IC®: a new immersion tin bath optimized for package substrate application. The process reduces the solder mask attack and the copper dissolution leading to minimized undercut. Stannatech IC has superior performance compared to Stannatech 2000 in regards to foaming and rinsability and is capable to work with the Stannatech auxiliary equipment.
- Stanna-Q®: an immersion tin process for QFN packages (Quad Flat No Leads Package). The process covers the exposed leadframe copper on the side of the QFN package by immersion tin in order to form a solder fillet during assembly.
- Stanna-COF®: an immersion tin bath for flex material such as chip on film. It is applicable with Atotech’s unique auxiliary equipment. That ensures the maximum productivity to our customers with minimized chemistry losses. Beneath a huge cost saving potential, also whisker mitigation ensures best in class quality.
- Stanna-Flex®: an immersion tin process specifically designed for flexible substrates. The 2 step tin process ensures a minimized copper attack in particular on substrates which contain solder mask. In order to allow best rinsability, the plating bath consist of low viscosity and by that enables excellent solution exchange also on small features. The process applicable with Atotech’s auxiliary equipment for maximum productivity and low chemical consumption.
Organic Solderable Finish (OSP)
- OS-Tech®: OS-Tech is a high-temperature organic surface finish that can withstand more than 5 reflow cycles with consistent layer thickness and soldering performance. The corresponding micro etch system specially designed to create the smoothest copper surface ensures a homogeneous even layer thickness distribution. The benefits described can all be achieved with a single step process.
- OS-Tech®SIT: this OSP finish provides a solderable environmentally friendly finish for SIT applications. The process can be combined with Atotech’s production proven ENIG processes and can be operated in vertical as well as horizontal processing. The organic layer is highly heat resistant and can withstand up to 5 times reflow cycles without any reduction in coating thickness.
Next generation palladium bath withlow Pd-content and highest stability
PD-Core® is our newest palladium bath that deposits pure palladium layers for the highest quality ENEPIG finishes. With the low Pd-content of 0.5 g/l Palladium, the process is highly cost-efficient as it significantly reduces the precious metal loss due to drag out.
Horizon Stannatech® 2000
The market leading immersion tin for the automotive industry, with over 10M m² being processed each year
Stannatech® 2000 offers the unique combination of chemical process and state of the art equipment from a single pool of expertise.
- Stannatech® 2000 is mass production proven and is qualified by the leading automotive end users
- Stannatech® 2000 offers unequalled process control and m²/l production capacity by employing auxillary equipment: Crystallizer™ and ConStannic™
- The experience gained from Stannatech® 2000 has facilitated the development of an i-Sn process for IC substrates and QFN production: Stannatech® IC and Stanna-Q® respectively
- Immersion tin is also a cost effective option for the emerging wearable market
“We offer the market final finishes that are systematically and statistically developed whilst reflecting the current requirement for technology based solutions. Specific cost and reliability requirements are all factored into our portfolio.”
Global Product Director Final Finishing at Atotech Germany
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552B has refocused the industry with reference to nickel corrosion. It could clearly be shown that HP ENIG is able to cope the demands of this spec. It adds further value through significantly better solderability than MP ENIG for similar gold layer thickness which can result in huge cost advantages for HP ENIG A great solder joint reliability performance especially after multiple reflow cycles, and improved aluminum wire bonding fracture modes contribute to its excellent performance. Finally, the amorphous structure as well as the electrochemically more noble behavior of the HP Ni reveals it as the best choice for exposure to corrosive media, either immersion Au baths and/or corrosive environment.
2018, PDF, 2,000 KB
How detrimental production concerns related to solder mask residues can be countered by simple operational adaptations
The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a ‘ping pong’ conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. Soldermasks identified as ‘critical’ in the field, and through testing, have been tested using state of the art technology to assess whether performance markers could be found.
2017, PDF, 1,000 KB