The new industry benchmark

Our true universal and economic PCB final finish


A new palladium electrolyte with low precious metal content and best in class stability

Low precious metal content

0.5 g/l Pd and Au for reduced process cost and lower precious metal loss by drag out

Long bath life, high stability

Increased bath life compared to existing processes with higher bath stability


Applicable for plating on nickel and copper for ENEPIG as well as EPAG finishes

PD-Core® is a new electrolyte for the electroless plating of palladium. It operates with a low content of 0.5 g/l palladium allowing the deposition of pure palladium layers with layer thicknesses of up to 400 nm and more. The process is stable in performance over long bath life and is characterized by an easy handling and maintenance. Due to its unique formulation it has a low sensitivity towards copper contamination and can therefore be plated directly on copper as well as on nickel.

  • Can be used as drop in solution in existing ENEPIG and EPAG lines
  • Pd-plating solution with high process robustness and low copper sensitivity
  • Economic process with low palladium content and mild process parameters

  • Low precious metal content
  • Long bath life, excellent bath stability
  • Applicable for multiple surface finish types

What inspires us

Why we developed PD-Core®

Your challenge

In order to reduce the cost for plating of palladium and gold driven by the increasing precious metal price, electrolytes with low precious metal content and excellent thickness distribution are required. On top of that, you can benefit from stable and robust plating processes which allow universal use for multiple final finish applications.

Our solution

PD-Core® is a new palladium plating electrolyte, which operates with low precious metal content and is characterized by an excellent bath stability and long lifetime. Due to its specific formulation it can be applied for the deposition of different kinds of surface finishes.

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