Aurotech® NIC 2
Mid phosphorous electroless nickel for high-end HDI
Compatible with exotic materials
ENIG and ENEPIG can be deposited defect-free and with no corrosive attacks
Completely ammonia-free
Reduces the risks associated with handling toxic substances and wastewater streams, increases overall operator safety
Combinable with Aurotech‘s latest gold and palladium electrolytes
Such as Aurotech® DC CH, Aurotech® AU Plus CH, and Aurotech® G-Bond 2 & 3
Aurotech® NIC 2 is an ammonia-free electroless nickel electrolyte that is specifically designed for the needs of new base materials and soldermasks. As no ammonia dosing is needed, it ensures easier and safer process handling. Like its predecessor, Aurotech® NIC, it exhibits good compatibility with exotic and low-profile base materials and shows low soldermask attack. With this, Aurotech® NIC 2 is ideally suited for high-end HDI production.
- Drop in replacement for existing electroless nickel electrolytes
- Ni-plating solution with high process robustness and material compatibility
- Economic process with high stability and long bath life
- Ammonia-free
- Reduced attack to base material, soldermask, and dry-film
- Very good solder wetting and wire bonding capabilities
- Excellent tape test results even after 3 x OSP etching
- IPC 4552B corrosion rating 0 and 1 in ENIG setting
- Stable performance and lifetime up to 4 MTO
- No dummy plating needed
What inspires us
Why we developed Aurotech® NIC 2
Your challenge
The increased complexity and higher performance demands in PCB manufacturing, driven by trends such as high-frequency applications and the use of exotic and low-profile base materials, have necessitated new solutions. Traditional electroless nickel electrolytes often struggle with compatibility, causing issues like chemical leaching and soldermask attack. Additionally, the use of ammonia in the process poses safety and environmental concerns, making it difficult to handle and manage in a production environment.
Our solution
Aurotech® NIC 2 addresses these challenges with an ammonia-free electroless nickel electrolyte optimized for high-end HDI production. This solution is specifically designed to be compatible with new base materials and soldermasks, reducing chemical leaching and soldermask attack. By eliminating the need for ammonia, Aurotech® NIC 2 ensures easier and safer process handling, enhances operator safety, and minimizes nitrogen in wastewater streams. Furthermore, it is combinable with the latest gold and palladium electrolytes, maintaining stable performance in plating, wetting, soldering, and bonding over a 4 MTO lifetime. This innovation ensures reliable, defect-free deposits for ENIG and ENEPIG applications, meeting the rigorous demands of modern PCB manufacturing.