Everplate® 2XT
Cost-effective copper damascene process
Damascene copper fill
For 28 nm nodes and above
Cost effective
High-yield and efficient fill
Excellent process control
Online analysis available (ECI, RTA)
Everplate® 2XT is a ECD Cu Damascene filling process and consists of a wide range of additives containing multiple accelerator, suppressor and leveler types that can be individually selected and combined for an optimum custom process performance. The process is compatible with a wide range of base electrolytes and designed to generate high yield fill for older generation technology nodes.
- Interconnect metallization
- Nodes >28 nm
- Excellent performance with a cost-effective solution
- Custom tailored chemistry suite for optimum performance on every application
- Copper film properties can be adjusted over a wide range to meet reliability targets
- Solutions available for a wide range of base electrolytes on all ECD Cu plating tools
- MKS’ Atotech offers process development and implementation expertise
What inspires us
Why we developed Everplate® 2XT
Your challenge
The damascene copper interconnect metallization process has been used successfully for many years now. It has proven to be a successful technology that enabled a true revolution in the chip interconnect metallization. Many applications across the field have reaped the benefits of this integration scheme varying from the most cutting-edge logic and memory to high power capable IGBTs. For some applications, interconnect dimensions have not been under the extreme pressure to reduce in size along with the most cutting-edge low power applications.
Our solution
The Everplate® 2XT additive suite is a customizable chemistry set, developed to offer solid performance for technology nodes at 28 nm and above. It provides a cost-effective solution that can be highly tailored to maximize yield and performance across a wide range of applications. We offer expertise in the selection, optimization, and implementation of a custom Everplate® process to meet and exceed performance targets while keeping an eye on robustness and return of investment.
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