Promobond® AP2
Adhesion promoter for mold/PI material on copper
Better adhesion of mold/ PI material to copper
Due to better anchoring of polymer with needle structure
Increased reliability of next generation packages
Due to controlled dense oxide formation, which prevents further uncontrolled oxidation
Improved composite formation
To ensure good ductility
Adhesion promoter
In advanced packaging applications, finest RDL as well as pillar structures are surrounded by polymeric mold/PI materials to ensure state of the art performance. Promobond® AP2 is a promoter designed to increase the adhesion of standard molds such as PI to plated Cu structures and the formation of composite layers at their interface. Treatment with Promobond® AP2 hence leads to significantly improved mechanical properties and increased reliabilities of Cu RDL and pillar structures when exposed to changing temperatures.
- Pillar and RDL plating
- Mold/PI material adhesion improvement after Cu plating
- Applicable in wet bench and spray type tool
- Controlled, self-limiting dense oxide formation protects from further uncontrolled oxidation
- Needle structures allow Cu/polymer composite formation
- Ensures good ductility of the mold/Cu combination
- Minimal required exposure time
- Excellent mechanical properties of Cu RDL and increased reliability
- Possibility of batch processing ensures cost efficient processing
What inspires us
Why we developed Promobond® AP2
Your challenge
State of the art heterogeneous integration in packaging processes requires the combination of a variety of different materials with different coefficients of thermal expansion (CTE). In a package, thermal expansion is mainly dominated by die and mold, which creates a high strain on thin RDL Cu lines. Temperature changes hence lead to increased stress due to different thermal expansion of the materials and thus to potential Cu RDL fractures. To minimize the risk of yield reduction and increase the reliability of the manufactured devices, outstanding mechanical properties of the Cu RDL structures are required. For pillars, the adhesion of the mold material to the Cu surface is crucial to avoid gap formation. A good ductility and adhesion of mold/PI to the Cu surface therefore has a significant influence on the overall performance and reliability.
Our solution
Promobond® AP2 is our adhesion promoter for Cu structures under patent application. Due to the controlled, fast, and self-limiting formation of oxides, excellent adhesion improvement of PI/molds to plated copper structures is achieved. This leads to excellent mechanical properties, significantly increased reliabilities and hence minimized failure rates.