Spherolyte®
Electrochemical plating solutions for pillar and RDL packaging applications
Highest speed plating
Pure and uniform metal deposition
Pillar and RDL plating
The Spherolyte® portfolio consists of pre-treatment solutions, various base electrolytes, and both two and three component additive systems. Spherolyte® chemistries are tailored for high end electrochemical processes for Cu, Ni, Sn, and Au in advanced packaging applications such as pillar and RDL structures.
Spherolyte® Cu is designed to enable pure and uniform Cu deposits at high speed, and with lower costs.
Following the Cu deposition for pillar formation, Spherolyte® Ni and Spherolyte® Sn are used as diffusion barrier and solder joint connection, respectively.
- Flip chip
- FOWLP
- MEMS
- Sensors
Our proven Spherolyte® portfolio satisfies the following process and deposition requirements at high speed:
Cu
- Sulfuric acid based Cu electrolyte system
- Pure Cu deposition and excellent WIW nonuniformity
- High speed plating
- Low warpage and internal stress
- Low organic impurities
Ni
- Sulfamate based solution
- Full liquid process
- Uniform Ni distribution as diffusion barrier
- Low porosity, high ductility
- Enhanced deposition rate
Sn
- Fine grain structures
- Good solderability
- High plating stability
- Inhibited whisker formation
Au
- Excellent bondability and solderability
- Excellent physical properties of the deposit
- Fast deposition rate
- Wide and robust process window
Aurolyte® Au may additionally be used for soldering and Au pillar plating in MEMS and sensor applications.
Why we developed Spherolyte®
Your challenge
Driven by cost reduction and increased performance, the main challenges for Cu pillar plating are: high throughput, no voiding in IMC, and excellent uniformity.
Our solution
Spherolyte® Cu is a high speed plating process that enables pure Cu deposition for void free plating and low non-uniformity.
Image gallery
Pillar plating
Copper fine line
Spherolyte® for pillar plating
