Technology of choice
for PCB and package substrate makers
High performance adhesion promotor for inner layer bonding
By preventing more than 95% of sludge, by lower COD and waste-waster
Great adhesion performance, thermal reliability and process control
Prevents high-resistance shorts and dendritic growth
Our high performance BondFilm HP® is the latest generation of our trusted BondFilm® series. It has been developed with the most demanding applications in mind, where residues, dirt and other contaminants must be excluded.
Our BondFilm HP® is used where products must be long lasting and reliable. Whether in the telecommunications sector or for automotive applications, the latest BondFilm® in the series is extremely versatile.
- Ultra low sludge formation
- Prevents high-resistance shorts and dendritic growth
- High copper loading
- Less waste-waster
- Less maintenance needed
- Lower etch-depth
- Great adhesion performance
- Greenest of BondFilm® yet
What inspires us
Why we developed BondFilm® HP
In order to satisfy the high quality standards of leading automotive and computing OEMs, only the best tools are sufficient. With BondFilm HP® you are well equipped to master the fierce competition.
BondFilm® HP is a clean pretreatment for inner layer bonding that makes producing flawless circuits a breeze.