BondFilm®

Simple, cost effective process for improved inner layer bonding

Superior process stability

Consistent performance across a broad temperature range, concentrations and pH

Multi-metal capability

One system for all metal substrates, eliminating additional lines

Environmentally sound

Free of P, Cr, Zn, Ni and Co

After BondFilm treatment x 5000

Top: Copper surface untreated x 5000, bottom: after BondFilm treatment x 5000


  • Consistent bonding enhancement
  • High copper loading (typically 28 g/l– 45 g/l)
  • Simple, dependable, low temperature process
  • Wider operating window
  • Greatly reducing the formation of “pink ring” and “wedge voids”
  • Lower cost of inner layer processing by improving yields
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  • Ideally suited for conveyorized application
  • Optimized for Laser Direct Drilling applications
  • Lower cost of inner layer processing by improving yields
  • Ideally matched chemistry and equipment for Atotech’s Horizon system

The BondFilm process consists of only three steps, which can be accomplished in horizontal or vertical mode:

Proper cleaning of the copper surface is a necessary prerequisite for the formation of the surface. BondFilm Cleaner ALK is an effective and simple alkaline cleaner for removal of soils and contaminants from the inner layer surface, this step is more than capable of removing fingerprints and any residues left on the surface.
Activation – Following the cleaning step, BondFilm Activator pretreats the Copper to create the proper surface conditions necessary for the formation of the adhesion layer itself. In addition to uniformly activating the Copper surface, this stage also protects the BondFilm process solution from contamination caused by “drag-in”.

Finally the activated copper surface is then treated in the BondFilmSolution to form the organo-metallic coating. This component system offers a high degree of operating flexibility with simplified process maintenance. This component system offers a high degree of operating flexibility with simplified process maintenance.

Typically, the entire BondFilm process, including rinsing and drying, requires only approximately three minutes for treatment in the conveyorized (horizontal) mode.

Atotech also offers equipment that is ideally suited and developed for the BondFilm process – the Horizon line.

What inspires us

Why we developed BondFilm

Your challenge

The whisker propensity of pure matt tin layers
has become one of the major concerns for the implementation of this technology as the lead-free solderable finish in IC assembly.

Our solution

BondFilm reduces the detrimental oxidizing effect of exposed copper to adjacent tin surfaces. Thus the formation of tin whiskers during heat / humidity storage is effectively mitigated.

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